90 projects on one chip, measured one by one and as a whole die
Buy a chip and boardPut your design on the next oneAll its projects on tinytapeout.com
The chip as a whole: what its projects add up to.
Projects
on the chip
Open source
with a public repository
Transistors
across the unique designs
Logic cells
gates and flip-flops
Counted inside the projects only, so these totals are smaller than the die's own figures on its run's page: the pads, Tiny Tapeout's multiplexer and controller and the fill are left out.
Tiny Tapeout puts many small designs on one chip. Start with a tile, then come back with a whole die.
Every Tiny Tapeout chip comes on a board you can plug in, with all of its projects ready to try.
Buy a chip and boardTiny Tapeout GF 26c and 26d take projects until 7 December 2026, to be made on wafer.space Run 3.
Submit a projectWhen a design outgrows a few tiles, it can have a die to itself on wafer.space Run 3: orders close 9 December 2026.
Reserve a slot
519
518
391
390
135
134
007
038
039
295
551
517
516
389
132
005
036
549
515
514
387
386
130
003
034
547
513
512
385
129
128
001
000
032
033
288
545
577
576
449
192
065
096
352
353
480
481
608
609
579
578
451
450
195
194
067
098
354
355
482
483
610
611
581
580
453
196
069
100
101
356
357
484
485
612
613
583
582
455
454
199
198
071
102
103
358
359
486
487
614
Every design rendered from the layout at the same scale and placed where it sits on the 3.9 × 5.1 mm die. Point at a project to see its name, and select it for its details.Every project is listed further down.
How many tiles each project took. A tile is the smallest piece of a Tiny Tapeout chip you can submit a design to.
| 1 × 1 tiles | 65 |
| 1 × 2 tiles | 15 |
| 2 × 2 tiles | 6 |
| 3 × 2 tiles | 2 |
| 3 × 4 tiles | 1 |
| 4 × 4 tiles | 1 |
| Total | 90 |
|---|
Two schedules meet here: Tiny Tapeout collects the projects and builds the die, then wafer.space manufactures it on wafer.space Run 2 and ships the parts.
Missed this one? Tiny Tapeout GF 26c and 26d take projects until 7 December 2026: submit a project.
From the wafer.space run schedule and the Tiny Tapeout GF 26b repository.
Where the area of 90 projects (9 mm² of silicon) actually went
The kinds of design on this chip.
Other digital 47 Accelerators 11 Security 7 RISC-V and CPUs 6 Communications 6 Games 5 Analog and mixed-signal 3 First designs 1 Art and logos 1 FPGA 1 Test structures 1 Retro computing 1The ready-made gate libraries the designs were built from: how many tracks tall each cell is, and the voltage it runs at.
| Standard cell library | Logic cells | Share |
|---|---|---|
| 7t-5V gf180mcu_fd_sc_mcu7t5v0 | 147k | 98% |
| AS 7t-3.3V gf180mcu_as_sc_mcu7t3v3 | 2k | 2% |
Each bar is one project, split the same way as above. Sorted by how much of the project is logic.
Transistor voltages and optional devices across the 90 designs
A design counts for a voltage when its standard cells, SRAM or its own transistors use it. 5 V and 6 V transistors share the thick gate oxide; a marker layer in the layout tells them apart.
Not drawn by any design: Native transistors, 10 V LDMOS, MIM capacitors, MOS capacitors, High-resistance poly resistors, Unsalicided poly resistors, Salicided poly resistors, Diffusion resistors, N-well resistors, Metal resistors, Diodes, Well diodes, Deep N-well, Bipolar transistors, Schottky diodes, Zener diodes, eFuses, One-time programmable memory, Inductors.
Only devices outside standard cells, SRAM macros and I/O pads count, since every die has those. A single test structure counts the same as a large block.
3.3 V transistors have the thin gate oxide; 5 V and 6 V ones share the thick one.
The maximum packs one cell type edge to edge with no room for wiring. Real designs need the wiring. Each box gives the most of a cell that fits with any GF180MCU library, then with the libraries this chip used.
Inverters per mm²
GF180MCU maximum,
with
AS 7t-3.3V
inv_2
With this chip's libraries:
AS 7t-3.3V: 114k inv_2
Buffers per mm²
GF180MCU maximum,
with
AS 7t-3.3V
buff_2
With this chip's libraries:
AS 7t-3.3V: 76k buff_2
Flip-flops per mm²
GF180MCU maximum,
with
AS 7t-3.3V
dfxtp_2
With this chip's libraries:
AS 7t-3.3V: 17k dfxtp_2
Typical project
median logic cells/mm² of core across 36 digital projects (1,000 or more logic cells)
58% of the core covered by logic cells
Percentages compare with the buffer maximum for each design's own library: buffers are among the smallest and most common logic cells, so a design made only of buffers, packed edge to edge with no wiring, would reach 100%.
What each tile size held on this chip, and what it would hold at its densities
| Logic cells in its digital projects1,000 or more logic cells | Logic cells at this chip's density | Theoretical maximum, 7t-5V cells | |||||||
|---|---|---|---|---|---|---|---|---|---|
| Tiles | Size | Core area | Projects | Most | Median | Typical21k / mm² | Best34k / mm² | NAND gatesnand2_1 | Flip-flopsdffq_1 |
| 1 × 1 | 0.35 × 0.16 mm | 0.06 mm² | 65 | 1.9k | 1.3k | 1.2k | 1.9k | 5.1k | 880 |
| 1 × 2 | 0.35 × 0.33 mm | 0.12 mm² | 15 | 3.3k | 2.4k | 2.5k | 3.9k | 10.5k | 1.8k |
| 2 × 2 | 0.71 × 0.33 mm | 0.23 mm² | 6 | 6.8k | 5.2k | 5.0k | 8.0k | 21.3k | 3.7k |
| 3 × 2 | 1.08 × 0.33 mm | 0.36 mm² | 2 | 8.2k | 7.5k | 7.6k | 12.1k | 32.5k | 5.6k |
| 3 × 4 | 1.08 × 0.74 mm | 0.80 mm² | 1 | 11.7k | 11.7k | 17.0k | 27.1k | 72.8k | 12.6k |
| 4 × 4 | 1.44 × 0.74 mm | 1.07 mm² | 1 | 30.2k | 30.2k | 22.7k | 36.2k | 97.1k | 16.7k |
Swipe the table sideways for more columns.
Core area is the whole project. "Typical" and "best" multiply the core area by this chip's median and best core densities; SRAM and analog blocks take their area out of that. The theoretical maxima fill the core with nothing but that one cell of 7t-5V, the library most used on this chip, edge to edge with no routing.
Pick the tile size your design needs when you submit it to the next Tiny Tapeout chip, by 7 December 2026.
A digital project here is one with 1,000 or more logic cells. Solid bar: average over the core. Outlined bar: the densest 0.1 mm square outside SRAM, per mm² (a dash where memory covers most of the design). The scale ends at the buffer theoretical maximum (76k cells/mm²). The numbers are core / densest, in logic cells per mm².
| Project | Tiles | Library | Logic cells | Inside core per mm² |
Densest 0.1 mm square per mm² |
Core covered | Core mm² |
|---|---|---|---|---|---|---|---|
| Car Trip 067 | 1 × 1 | 7t-5V | 1,901 | 33,946 | 39,800 | 80% | 0.06* |
| LEA-128 195 | 2 × 2 | 7t-5V | 6,850 | 29,236 | 38,300 | 76% | 0.23* |
| Neural Spike Detector 036 | 1 × 2 | 7t-5V | 3,296 | 28,537 | 40,700 | 72% | 0.12* |
| Elemental Harmony Game 386 | 2 × 2 | 7t-5V | 6,656 | 28,408 | 43,800 | 60% | 0.23* |
| ASCON Integrated Crypto Processor 295 | 4 × 4 | 7t-5V | 30,184 | 28,326 | 36,000 | 83% | 1.07* |
| BRISQ 551 | 1 × 1 | 7t-5V | 1,555 | 27,768 | 32,600 | 76% | 0.06* |
| Arctic0 16-bit CPU 356 | 1 × 2 | 7t-5V | 3,152 | 27,290 | 35,800 | 79% | 0.12* |
| 4-Neuron LIF Spiking Neural Network 071 | 1 × 1 | 7t-5V | 1,459 | 26,054 | 30,000 | 77% | 0.06* |
| PWM-Analyser 354 | 1 × 2 | 7t-5V | 2,960 | 25,628 | 32,700 | 76% | 0.12* |
| Smerity-Mandelbrot 390 | 2 × 2 | 7t-5V | 5,977 | 25,510 | 31,700 | 65% | 0.23* |
| Detronyx Arithmetic Lab Tile 612 | 1 × 1 | AS 7t-3.3V | 1,427 | 25,482 | 32,400 | 74% | 0.06* |
| 60 Hz Grid-Forming ASIC with Dump-Load Control 033 | 1 × 2 | 7t-5V | 2,936 | 25,420 | 30,300 | 70% | 0.12* |
| PDM Voice Activity Detector 610 | 1 × 1 | 7t-5V | 1,357 | 24,232 | 28,600 | 61% | 0.06* |
| Lightscan 038 | 1 × 2 | 7t-5V | 2,796 | 24,208 | 29,800 | 69% | 0.12* |
| Simon Says memory game 613 | 1 × 1 | 7t-5V | 1,301 | 23,232 | 37,200 | 64% | 0.06* |
| Pong 358 | 1 × 2 | 7t-5V | 2,680 | 23,203 | 28,700 | 63% | 0.12* |
| AER Reflex Chip - MCP2515 CAN gateway 101 | 3 × 2 | 7t-5V | 8,164 | 22,907 | 28,500 | 63% | 0.36* |
| Hardware UTF Encoder/Decoder 453 | 1 × 1 | 7t-5V | 1,220 | 21,786 | 36,100 | 51% | 0.06* |
| 100Mbps Ethernet Accelerator Wrapper 288 | 1 × 2 | 7t-5V | 2,406 | 20,831 | 26,000 | 63% | 0.12* |
| Aswarby INT8 MAC 581 | 1 × 1 | 7t-5V | 1,146 | 20,464 | 28,700 | 53% | 0.06* |
| Music for ASICs 103 | 1 × 2 | 7t-5V | 2,360 | 20,433 | 27,800 | 53% | 0.12* |
| wafer.space Logo VGA Screensaver 102 | 1 × 2 | 7t-5V | 2,228 | 19,290 | 27,300 | 53% | 0.12* |
| 2048 sliding tile puzzle game (VGA) 135 | 3 × 2 | 7t-5V | 6,736 | 18,900 | 30,000 | 53% | 0.36* |
| I2C Slave Template with Emulated Sensor 517 | 1 × 1 | 7t-5V | 1,051 | 18,768 | 23,100 | 56% | 0.06* |
| Spiking Neural Network WTA Inference Engine (GF180) 454 | 2 × 2 | 7t-5V | 4,367 | 18,638 | 28,700 | 53% | 0.23* |
| Tiny RIng Oscillator PUF 547 | 1 × 1 | 7t-5V | 1,039 | 18,554 | 46,600 | 46% | 0.06* |
| Quadrature sine generator 545 | 1 × 1 | 7t-5V | 1,017 | 18,161 | 27,400 | 50% | 0.06* |
| Neuromorphic PUF (distinct-tap LFSR arbiter + memristor XOR, GF180) 100 | 1 × 2 | 7t-5V | 1,971 | 17,065 | 26,500 | 55% | 0.12* |
| Neuromorphic Spike Codec (GF180) 034 | 1 × 2 | 7t-5V | 1,899 | 16,442 | 27,600 | 45% | 0.12* |
| CIM Controller with BIST and Fault Map (GF180) 098 | 1 × 2 | 7t-5V | 1,759 | 15,229 | 29,300 | 47% | 0.12* |
| Programmable Waveform and PWM Generator 450 | 2 × 2 | 7t-5V | 3,560 | 15,194 | 29,000 | 48% | 0.23* |
| ChaCha20 039 | 3 × 4 | 7t-5V | 11,717 | 14,661 | 35,300 | 38% | 0.80* |
| 100Mbps 3 port Ethernet switch 199 | 2 × 2 | 7t-5V | 3,297 | 14,072 | 30,700 | 52% | 0.23* |
| Asynchronous-AER Spike Router (4-phase REQ/ACK, 16-entry routing table, GF180) 096 | 1 × 2 | 7t-5V | 1,594 | 13,801 | 23,000 | 49% | 0.12* |
| Procedural ASIC 352 | 1 × 2 | 7t-5V | 1,581 | 13,688 | 30,500 | 37% | 0.12* |
| CWRU CHIPS Simple Counter with 7-segment Display 129 | 1 × 2 | 7t-5V | 1,478 | 12,797 | 31,500 | 34% | 0.12* |
Every project on this chip: an index, then grouped by what it does. Select one for its layout, its measurements and any die photographs.
All 90 projects by their address on the chip's multiplexer, with how many tiles each took and how much logic it packs.
Swipe the table sideways for more columns.
Some designs on this chip have been made many times, on earlier and later Tiny Tapeout chips, and several now have a whole die of their own on a wafer.space run. The ringed marker is this chip.
Tiny Tapeout tile
Google shuttle
wafer.space die
this chip
Each marker is one version of the design: hover over it or focus it for details, and select it to open its
page. On a phone, the table below lists every one.
| Design | Made on | When | Version | Size |
|---|---|---|---|---|
| Expresso Ethernet switch | Tiny Tapeout GF 0.3 | Jun 2026 | Until heat death do us part | 2 × 2 tiles |
| Tiny Tapeout GF 26b | Jun 2026 | 100Mbps 3 port Ethernet switch; 100Mbps Ethernet Accelerator Wrapper | 2 × 2 tiles, 1 × 2 tiles | |
| wafer.space Run 2 | Jul 2026 | CAFE Expresso Ethernet Chip: 100Mbps Ethernet switch + Heat death of the Universe Beacon - 0.5x0.5 version - Preferred version | ½ × ½ slot |
The die as a whole, measured like every other design on its run: its size, pads, process features, density, precheck and photographs. See every design on wafer.space Run 2
Rendered from the layout at 2.5 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings
| Inside the core logic cells per mm² | 12k
(16% of buffer maximum) over the 12.90 mm² core: what the design itself packed |
|---|---|
| Inside the seal ring logic cells per mm² | 8k
over all 19.65 mm² of the slot, pad ring included |
| Densest mm² logic cells per mm² | 25k (32% of buffer maximum) |
| Core covered by logic | 35% |
| Transistor density transistors per mm² | 227k average, 306k in the mm² with the most logic cells |
Every figure here is measured from the public layout, the same way for every design on the run: see data and method, and how its designs used the process.
| Die | 3.93 × 5.12 mm (20.1 mm²) |
|---|---|
| Core area | 12.90 mm² inside the pad ring
the project template's, 442 µm in from each edge |
| Inside the seal ring | 19.65 mm² (the die less its 26 µm seal ring) |
| Placements | 1 on the reticle, in slot B3 |
| Bond pads | 74 |
| Transistors | 2,927,843 |
| Logic cells | 155,961 + 329,068 filler and tap cells |
| Libraries | 7t-5V (154k), AS 7t-3.3V (2k) |
| SRAM | custom layout |
| Licence | Apache-2.0 declared
Repository: Apache-2.0 in LICENSE — agrees |
|---|---|
| How it was checked | Commit and PDK pinThe licence and template were read from the repository at commit 8c92b24e237f. |
| Chip-on-board | Not selected at submission |
| Precheck | Passed
the check it was accepted on, 2026-07-04
Passed latest re-run, 2026-08-02, gf180mcu-precheck 1.7.3 step results and logs |
Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.
| 3.3 V | AS 7t-3.3V standard cells, 38,977 custom transistors |
|---|---|
| 5 V | 7t-5V standard cells, 7,382 custom transistors |
| Gate oxides | Thin (3.3 V) and thick (5 V/6 V) in the design itself |
| I/O library | gf180mcu_ocd_io (1140 cells) |
How this design's area splits between logic cells, filler and tap cells, other and pad ring.
The ten standard cells this design uses most.
| Cell | Library | Instances | What it does |
|---|---|---|---|
| nand2_1 | 7t-5V | 16,096 | 2-input NAND gate |
| oai21_1 | 7t-5V | 9,720 | OR-AND-Invert compound gate |
| dffq_1 | 7t-5V | 9,396 | D flip-flop (1 bit storage) |
| nor2_1 | 7t-5V | 9,393 | 2-input NOR gate |
| clkinv_1 | 7t-5V | 9,188 | Clock inverter |
| dffrnq_1 | 7t-5V | 7,995 | D flip-flop with reset |
| dlyb_1 | 7t-5V | 7,963 | Delay buffer |
| aoi21_1 | 7t-5V | 7,798 | AND-OR-Invert compound gate |
| buf_2 | 7t-5V | 5,436 | Buffer (2x drive) |
| aoi22_1 | 7t-5V | 5,356 | AND-OR-Invert (2x2 inputs) |
Logic cells per mm² in each square millimetre of the die. Hatched outlines are SRAM macros; the red outline is the densest mm² that avoids them (25k logic cells per mm²), found by sliding a 1 mm square over the die in 0.1 mm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.
Before a design is made, the wafer.space platform checks it against the foundry's design rules. T26B was accepted on this check, and has been checked again since with newer rules.
All 16 steps passed, with 0 KLayout DRC errors, on 2026-07-04.
| Step | Accepted on check 335, 2026-07-04, initial | Latest re-run check 740, 2026-08-02, drc_update, gf180mcu-precheck 1.7.3 PDK open_pdks 1.0.604, LibreLane 5fe3db1 |
|---|---|---|
| KLayout.ReadLayout | passed | passed |
| KLayout.CheckTopLevel | passed | passed |
| KLayout.CheckSize | passed | passed |
| KLayout.GenerateID | passed | passed |
| KLayout.Render | passed | passed |
| KLayout.Density | passed | passed |
| Checker.KLayoutDensity | passed | passed |
| KLayout.ZeroAreaPolygons | passed | passed |
| Checker.KLayoutZeroAreaPolygons | passed | passed |
| KLayout.Antenna | passed | passed |
| Checker.KLayoutAntenna | passed | passed |
| Magic.DRC | passed | passed |
| Checker.MagicDRC | advisory warning | advisory warning |
| KLayout.DRC | passed | passed |
| Checker.KLayoutDRC | passed | passed |
| KLayout.WriteLayout | passed | passed |
| KLayout DRC errors | 0 | 0 |
| Magic DRC errors (advisory) | 42,336 | 42,336 |
| Files | steps · log (gzip) | steps · log (gzip) |
The steps of the gf180mcu-precheck LibreLane flow, as run by platform.wafer.space. The design was accepted on the newest finished check before it was submitted; later re-runs check the same file with updated rules. KLayout DRC is the sign-off check. Magic DRC is advisory: its count does not stop a design. In the logs, Magic's "Error while reading cell" lines about fill cells are messages from its reader, not check failures.
Everything on this page is measured from the public layout; the dates come from the published schedules.
The full written analysis is the density report. The measurements behind it:
Generated by ws-run-reports from layout/T26B.oas (md5 a905e364075a3362a8629aee939dd5e6).
Tiny Tapeout is the quickest and cheapest way to get your own design made on a real chip.
Many designs share one Tiny Tapeout chip. Each project gets one or more small tiles, and a multiplexer on the chip connects the one you choose to the pins. Draw your first design in the browser with no experience by following the digital design guide, or write it in Verilog or another HDL; Tiny Tapeout's templates build and check it on GitHub. The chip comes on a demo board that selects your design and drives it.
Tiny Tapeout also runs workshops and supports teaching in universities and schools. Browse every Tiny Tapeout chip and the projects proven in silicon, or read the Tiny Tapeout FAQ.
Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.