Tiny Tapeout GF 26b · Die T26B on wafer.space Run 2

BRISQ

551 · Other digital · 1 × 1 tile

by Poiku

Rendered from the layout at 0.33 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Core average
logic cells per mm²
28k (37% of buffer maximum)
Densest 0.1 mm square
logic cells per mm²
33k (43% of buffer maximum)
Core covered by logic76%
Transistor density
transistors per mm²
309k average, 309k in the 0.1 mm square with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.

BRISQ: Binary Reduced Inverse SQrt

Size347 × 161 µm (0.056 mm²)
Macrott_um_brisq
Filesdocumentation · licence · layout and netlist in Tiny Tapeout GF 26b
Tiles1 × 1 at column 0, row 19 of the tile grid
Mux address551
LanguageSystemVerilog
Clock25 MHz
Built withLibreLane 3.0.3, open_pdks 54435919abff
Transistors17,287
Logic cells1,555 + 1,499 filler and tap cells
Libraries 7t-5V (2k)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this project's area splits between logic cells, filler and tap cells and other.

76%
16%
  • Logic cells 0.04 mm² (76%)
  • Filler and tap cells 0.01 mm² (16%)
  • Other 4,033 µm² (7%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
nand2_17t-5V 1732-input NAND gate
xor2_17t-5V 1432-input XOR gate
nor2_17t-5V 1352-input NOR gate
oai21_17t-5V 71OR-AND-Invert compound gate
aoi21_17t-5V 69AND-OR-Invert compound gate
clkinv_17t-5V 67Clock inverter
buf_27t-5V 61Buffer (2x drive)
xnor2_17t-5V 492-input XNOR gate
nor2_27t-5V 422-input NOR gate (2x drive)
clkbuf_17t-5V 36Clock buffer

Logic density map

270 logic cells, 2,734 transistors 295 logic cells, 3,300 transistors 289 logic cells, 3,461 transistors 154 logic cells, 1,361 transistors 146 logic cells, 1,563 transistors 191 logic cells, 1,929 transistors 150 logic cells, 2,092 transistors 60 logic cells, 847 transistors Densest SRAM-free 0.1 mm square: 326 logic cells 27k 29k 29k 15k 19k 15k

Logic cells per mm² in each 0.1 mm square of the project (counted in the square, scaled up to a mm²). Hatched outlines are SRAM macros; the red outline is the densest 0.1 mm square that avoids them (33k logic cells per mm²), found by sliding a 0.1 mm square over the project in 20 µm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Want your own design on a chip like this one?

Start with a tile: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3. For a die of your own, wafer.space Run 3 takes orders until 9 December 2026.

Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.