RISC-V
KianV RV32IMA
RISC-V SoC running Linux on GF180MCU
Budget silicon manufacturing.
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Budget silicon manufacturingCreate integrated circuits without breaking the bank!Learn how!
Half Slots Are Here!
Get 1,000 custom silicon dies from just $4 per die
New half-width (0.5×1 slot) and half-height (1×0.5 slot) options — 1,000 dies for $4,000 with Early Bird pricing.
See Half Slot PricingDeadlines
wafer.space GF180MCU Run 2
Early Bird Deadline
Lock in early bird pricing for GF180MCU Run 2
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Purchase & Submission Deadline
Final deadline to purchase a slot and submit your GDS
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Complete Timeline
| Milestone | Date | Description |
|---|---|---|
| Campaign Opens | 1 March 2026 | Run 2 slots available for purchase on Crowd Supply |
| Early Bird Deadline | 30 April 2026 @ 11:59 PM AoE | Last day to purchase at early bird pricing |
| Purchase & Submission Deadline | 30 June 2026 @ 11:59 PM AoE | Final deadline to purchase slots and submit GDS files |
| Parts Shipped | Early Q4 2026 | Bare dies and packaged parts shipped to customers |
Ready to design your chip?
Your design. Your silicon. From $4 per die.
Get Started
- Project template — start your design from a working example
- PDK documentation — GF180MCU process design kit reference
- Slot specifications — die dimensions, pad rings, and I/O details
- Community Discord — chat with other designers and get free help
Need Help?
Professional design services are available from independent consultants experienced with the GF180MCU process. Whether you need a full custom design, help with verification, or guidance on your first tapeout, experts are ready to assist.
- Browse professional services — find a consultant for your project
- Join the Discord — free community support and peer help
Pricing
Slot Comparison
Choose the size that fits your design
| Feature | 1×1 Slot |
New! 0.5×1 Slot |
New! 1×0.5 Slot |
|---|---|---|---|
| Die Size | 3.93 × 5.12 mm | 1.94 × 5.12 mm | 3.93 × 2.53 mm |
| Die Area | 20.12 mm² | 9.93 mm² | 9.94 mm² |
| Usable Silicon† | 19.65 mm² | 9.57 mm² | 9.61 mm² |
| Core Area* | 12.92 mm² | 4.46 mm² | 5.02 mm² |
| Default I/O Pads† | 56 | 56 | 56 |
| Max I/O Pads‡ | 168 | 122 | 108 |
| Early Bird Price | $7,000 | $4,000 | $4,000 |
| Standard Price | $7,500 | $4,500 | $4,500 |
| Per Die (Early Bird) | $7.00 | $4.00 | $4.00 |
†Default pad ring I/O count. The default pad ring is only required if you purchase the Chip on Board packaging add-on.
‡Maximum I/O with a custom pad ring from the LibreLane pad ring generator. You are free to use any pad ring configuration — or no pad ring at all.
*Usable silicon = die area minus seal ring (~26µm each side). Available with a custom pad ring or no pad ring.
*Core area = area inside the default pad ring.
$4.00 / die
USD $4,000
Early Bird
$4.50 / die
USD $4,500
Standard
0.5×1 Slot (Half Width) New!
0.5×1 Slot — 1000 dies per slot
The half-width (0.5×1) slot delivers a tall, narrow die — ideal for I/O-heavy designs where signals concentrate along the long edges. Perfect for medium-complexity digital or mixed-signal projects, at just over half the cost of a full slot.
- GF180MCU process — 180nm mixed-signal
- Die size: 1.94mm × 5.12mm (9.93 mm²)
- Usable silicon: 9.57 mm² (custom pad ring or none)
- Core area: 4.46 mm² (default pad ring, required for COB)
- Default: 56 I/O pads — max: up to 122 I/O with custom pad ring
- 5 metal layers, MIM capacitors, poly & high-res resistors
- Early Bird pricing available through 30 April 2026
$4.00 / die
USD $4,000
Early Bird
$4.50 / die
USD $4,500
Standard
1×0.5 Slot (Half Height) New!
1×0.5 Slot — 1000 dies per slot
The half-height (1×0.5) slot gives you a wide, short die — ideal for designs that benefit from a wider core. Offers slightly more core area than the half-width slot at the same price.
- GF180MCU process — 180nm mixed-signal
- Die size: 3.93mm × 2.53mm (9.94 mm²)
- Usable silicon: 9.61 mm² (custom pad ring or none)
- Core area: 5.02 mm² (default pad ring, required for COB)
- Default: 56 I/O pads — max: up to 108 I/O with custom pad ring
- 5 metal layers, MIM capacitors, poly & high-res resistors
- Early Bird pricing available through 30 April 2026
$7.00 / die
USD $7,000
Early Bird
$7.50 / die
USD $7,500
Standard
1×1 Slot (Full)
1×1 Slot — 1000 dies per slot
The full-size slot gives you the largest die area and maximum I/O count. Ideal for complex SoCs, full mixed-signal designs, or projects that need the most routing and core area.
- GF180MCU process — 180nm mixed-signal
- Die size: 3.93mm × 5.12mm (20.12 mm²)
- Usable silicon: 19.65 mm² (custom pad ring or none)
- Core area: 12.92 mm² (default pad ring, required for COB)
- Default: 56 I/O pads — max: up to 168 I/O with custom pad ring
- 5 metal layers, MIM capacitors, poly & high-res resistors
- Early Bird pricing available through 30 April 2026
Enhance Your Order
Get your chips packaged and ready to test, or take home an entire wafer
Learn More
Chip on Board Packaging
$1,500
USD
· $1.50 per die
Receive your dies wire-bonded onto small PCBs, ready for testing and integration.
- Wire-bonded onto individual PCBs
- Ready to power up and test immediately
- Requires the default pad ring for wire bonding
Add-on to any slot purchase. Requires the default pad ring.
Add to Order
Learn More
Full Undiced Wafer
$2,000
USD
Take home a complete 200mm wafer with your design alongside other Run 2 projects.
- Complete 200mm wafer, uncut
- Includes all designs from this run
- Perfect for custom dicing or display
Requires slot purchase
Add to OrderTechnology
Technical Specifications
GF180MCU Process Technology Details
Slot Options
3 Sizes
1×1, 0.5×1 half-width, 1×0.5 half-height
Metal Layers
5 Layers
Full routing capability
Quantity
1,000 dies
Per manufacturing slot
Capacitors
MIM & PIP
Metal-insulator-metal available
Resistors
Poly & High-Res
Multiple resistor types
Run 1: Many Designs on a Single Reticle
29 open-source designs from universities, startups, and hobbyists worldwide
Silicon currently in fabrication — expected delivery late April 2026
KIAN
1×1 slot
MOLE
1×1 slot
RBOY
1×1 slot
RZ80
1×1 slot
GD03
1×1 slot
CHES
1×1 slot
TTP2
1×1 slot
2975
1×1 slot
ISHI
1×1 slot
WSLG
1×1 slot
What fits on 1 mm² of GF180MCU silicon?
Theoretical maximum standard cell density
Hard upper bounds — if you packed cells edge-to-edge with zero routing overhead
~14,320
Flip-Flop (FF_1)
per mm² theoretical max
~30,430
Buffer (BUF_4)
per mm² theoretical max
~39,380
3-input AND (AND3_2)
per mm² theoretical max
What Run 1 designers actually achieved
Real density from 24 designs on the GF180MCU shuttle
3k–14k
Typical Range
logic cells/mm² for most digital designs
across 24 designs
Achieved Logic Density by Design
| Design | Library | Core SC/mm² | % of max | Logic Cells | SRAM |
|---|---|---|---|---|---|
| Cloneless1 | 7t-5V | 22k | 44% | 316k | 0 |
| Tiny Tapeout (52 sub-designs) | mixed | 14k | 29% | 204k | 0 |
| FABulous FPGA | 7t-5V | 14k | 29% | 204k | 12 |
| Chess Move Gen. | 9t-5V | 10k | 25% | 145k | 0 |
| FazyRV Hachure | 7t-5V | 7k | 14% | 101k | 40 |
| KianV RISC-V | 9t-5V | 6k | 16% | 89k | 42 |
| Racquet 23-core | 7t-5V | 5k | 11% | 78k | 46 |
Data from the Run 1 Density Report. Logic cell counts exclude infrastructure cells (fillers, taps, antenna diodes). “% of max” compares against buf theoretical max for each library (50k for 7-track, 40k for 9-track).
What fits in each slot?
Logic and memory capacity by slot type
Theoretical Logic Capacity (with default pad ring)
| Cell Type | 1×1 Slot |
New! 0.5×1 Slot |
New! 1×0.5 Slot |
|---|---|---|---|
| Flip-Flop (FF_1) | ~185,014 | ~63,867 | ~71,886 |
| Buffer (BUF_4) | ~393,156 | ~135,718 | ~152,759 |
| 3-input AND (AND3_2) | ~508,790 | ~175,635 | ~197,688 |
Theoretical maximums with zero routing overhead. Run 1 designs typically achieved 10–44% of these values.
SRAM Capacity
| SRAM Type | Voltage | 1×1 Slot | 0.5×1 Slot | 1×0.5 Slot |
|---|---|---|---|---|
| GF 5V sram512x8 | 5V | 40 kilobytes (80 blocks) | 20 kilobytes (40 blocks) | 20 kilobytes (40 blocks) |
| GF 5V sram256x8 | 5V | 28 kilobytes (112 blocks) | 14 kilobytes (56 blocks) | 14 kilobytes (56 blocks) |
| 3.3V sram1024x8 | 3.3V | 108 kilobytes (108 blocks) | 54 kilobytes (54 blocks) | 48 kilobytes (48 blocks) |
| 3.3V sram512x8 | 3.3V | 90 kilobytes (180 blocks) | 45 kilobytes (90 blocks) | 42 kilobytes (84 blocks) |
| 3.3V sram256x8 | 3.3V | 66 kilobytes (264 blocks) | 33 kilobytes (132 blocks) | 33 kilobytes (132 blocks) |
Block counts use die area minus seal ring (26µm each side). Run 1’s most SRAM-heavy design (RISCBoy-180) used 60 blocks in a full slot.
Theoretical numbers use core area (with default pad ring). Using your own pad ring or no pad ring increases available area.
Real designs achieve 10–44% of theoretical max due to routing overhead, infrastructure cells (~75% of instances), power planning, and clock distribution.
3.3V SRAM blocks from Tim Edwards and Tholin, introduced in Run 1.
Full analysis: Run 1 Standard Cell & SRAM Density Report.
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