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GF180MCU Shuttle Slot
Wire-Bonded
$
8,500
USD
| GF180MCU Process |
| ~20mm2 silicon |
| 3.88mm x 5.07mm die size |
| 1,000 die wire bonded onto PCBs |
GF180MCU Shuttle Slot
Bare Dies
$
7,000
USD
| GF180MCU Process |
| ~20mm2 silicon |
| 3.88mm x 5.07mm die size |
| 1,000 raw dies |
Undiced
Full Wafer
$
2,000
USD
| Undiced 200mm wafer. |
| Only valid with slot purchase. |
Deadlines
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Complete Timeline
| Milestone | Date | Description |
|---|---|---|
| Purchase Deadline | 28 November 2025 | Final deadline to purchase manufacturing slots |
| Design Submission | 3 December 2025 | Final deadline to submit GDS files for fabrication |
| Tape-out to GlobalFoundries | 5 December 2025 | GDS files delivered to GlobalFoundries for fabrication |
| Fabrication Complete | February 2026 | Wafers returned from GlobalFoundries fabrication |
| Delivery to Customers | 15 March 2026 | Finished dies shipped to customers worldwide |
Technical Specifications
GF180MCU Process Technology Details
Die Dimensions
19.67 mm²
3.88mm × 5.07mm
Metal Layers
5 Layers
Full routing capability
Quantity
1,000 dies
Per manufacturing slot
Capacitors
MIM & PIP
Metal-insulator-metal available
Resistors
Poly & High-Res
Multiple resistor types
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