Budget silicon manufacturing.
Pricing
Choose the slot that fits your design and budget
Slot Comparison
Choose the size that fits your design
| Feature | 1×1 Slot | 0.5×1 Slot | 1×0.5 Slot |
New! 0.5×0.5 Slot |
|---|---|---|---|---|
| Die Size | 3.93 × 5.12 mm | 1.94 × 5.12 mm | 3.93 × 2.53 mm | 1.94 × 2.53 mm |
| Die Area* | 20.12 mm² | 9.93 mm² | 9.94 mm² | 4.9 mm² |
| Core Area† | 12.92 mm² | 4.46 mm² | 5.02 mm² | 1.73 mm² |
| Default I/O Pads‡ | 56 | 56 | 56 | 48 |
| Max I/O Pads§ | 168 | 122 | 108 | 48 |
| Early Bird Price | $7,000 | $4,000 | $4,000 | $2,000 |
| Standard Price | $8,000 | $5,000 | $5,000 | $3,000 |
| Per Die (Early Bird) | $7.00 | $4.00 | $4.00 | $2.00 |
*Usable die area is smaller due to the seal ring (~26µm each side). Available with a custom pad ring or no pad ring.
†Core area = area inside the default pad ring.
‡Default pad ring I/O count. The default pad ring is only required if you purchase the Chip on Board packaging add-on.
§Maximum I/O with a custom pad ring from the LibreLane pad ring generator. You are free to use any pad ring configuration — or no pad ring at all.
USD $4,000
Early Bird
USD $5,000
Standard
0.5×1 Slot (Half Width)
0.5×1 Slot — 1000 dies per slot
The half-width (0.5×1) slot delivers a tall, narrow die — ideal for I/O-heavy designs where signals concentrate along the long edges. Perfect for medium-complexity digital or mixed-signal projects, at just over half the cost of a full slot.
- GF180MCU process — 180nm mixed-signal
- Die size: 1.94mm × 5.12mm (9.93 mm²)
- Usable silicon: 9.57 mm² (custom pad ring or none)
- Core area: 4.46 mm² (default pad ring, required for COB)
- Default: 56 I/O pads — max: up to 122 I/O with custom pad ring
- 5 metal layers, MIM capacitors, poly & high-res resistors
USD $4,000
Early Bird
USD $5,000
Standard
1×0.5 Slot (Half Height)
1×0.5 Slot — 1000 dies per slot
The half-height (1×0.5) slot gives you a wide, short die — ideal for designs that benefit from a wider core. Offers slightly more core area than the half-width slot at the same price.
- GF180MCU process — 180nm mixed-signal
- Die size: 3.93mm × 2.53mm (9.94 mm²)
- Usable silicon: 9.61 mm² (custom pad ring or none)
- Core area: 5.02 mm² (default pad ring, required for COB)
- Default: 56 I/O pads — max: up to 108 I/O with custom pad ring
- 5 metal layers, MIM capacitors, poly & high-res resistors
USD $7,000
Early Bird
USD $8,000
Standard
1×1 Slot (Full)
1×1 Slot — 1000 dies per slot
The full-size slot gives you the largest die area and maximum I/O count. Ideal for complex SoCs, full mixed-signal designs, or projects that need the most routing and core area.
- GF180MCU process — 180nm mixed-signal
- Die size: 3.93mm × 5.12mm (20.12 mm²)
- Usable silicon: 19.65 mm² (custom pad ring or none)
- Core area: 12.92 mm² (default pad ring, required for COB)
- Default: 56 I/O pads — max: up to 168 I/O with custom pad ring
- 5 metal layers, MIM capacitors, poly & high-res resistors
Enhance Your Order
Get your chips packaged and ready to test, or take home an entire wafer
Learn More
Chip on Board Packaging
Receive your dies wire-bonded onto small PCBs, ready for testing and integration.
- Wire-bonded onto individual PCBs
- Ready to power up and test immediately
- Requires the default pad ring for wire bonding
Add-on to any slot purchase. Requires the default pad ring.
Add to Order
Learn More
Full Undiced Wafer
Take home a complete 200mm wafer with your design alongside other Run 2 projects.
- Complete 200mm wafer, uncut
- Includes all designs from this run
- Perfect for custom dicing or display
Requires slot purchase
Add to OrderDeadlines
wafer.space GF180MCU Run 3
Early Bird Deadline
Lock in early bird pricing for GF180MCU Run 3
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Purchase Deadline
Final deadline to purchase a slot and submit your GDS
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Submission Deadline
Final deadline to submit a clean GDS
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Complete Timeline
| Milestone | Date | Description |
|---|---|---|
| Campaign Opens | 1 August 2026 | Run 3 slots available for purchase on Crowd Supply |
| Early Bird Deadline | 30 September 2026 @ 11:59 PM AoE | Last day to purchase at early bird pricing |
| Purchase Deadline | 9 December 2026 @ 11:59 PM AoE | Final deadline to purchase slots |
| Submission Deadline | 16 December 2026 @ 11:59 PM AoE | Final deadline to submit clean GDS |
| Parts Shipped | Q2 2027 | Bare dies and packaged parts shipped to customers |
Ready to design your chip?
Your design. Your silicon. From $2 per die.
Get Started
- Project template — start your design from a working example
- PDK documentation — GF180MCU process design kit reference
- Slot specifications — die dimensions, pad rings, and I/O details
- Community Discord — chat with other designers and get free help
Need Help?
Professional design services are available from independent consultants experienced with the GF180MCU process. Whether you need a full custom design, help with verification, or guidance on your first tapeout, experts are ready to assist.
- Browse professional services — find a consultant for your project
- Join the Discord — free community support and peer help