Budget silicon manufacturing.
Pricing
Choose the slot that fits your design and budget
Slot Comparison
Choose the size that fits your design
| Feature | 1×1 Slot |
New! 0.5×1 Slot |
New! 1×0.5 Slot |
|---|---|---|---|
| Die Size | 3.93 × 5.12 mm | 1.94 × 5.12 mm | 3.93 × 2.53 mm |
| Die Area | 20.12 mm² | 9.93 mm² | 9.94 mm² |
| Usable Silicon† | 19.65 mm² | 9.57 mm² | 9.61 mm² |
| Core Area* | 12.92 mm² | 4.46 mm² | 5.02 mm² |
| Default I/O Pads† | 56 | 56 | 56 |
| Max I/O Pads‡ | 168 | 122 | 108 |
| Early Bird Price | $7,000 | $4,000 | $4,000 |
| Standard Price | $7,500 | $4,500 | $4,500 |
| Per Die (Early Bird) | $7.00 | $4.00 | $4.00 |
†Default pad ring I/O count. The default pad ring is only required if you purchase the Chip on Board packaging add-on.
‡Maximum I/O with a custom pad ring from the LibreLane pad ring generator. You are free to use any pad ring configuration — or no pad ring at all.
*Usable silicon = die area minus seal ring (~26µm each side). Available with a custom pad ring or no pad ring.
*Core area = area inside the default pad ring.
USD $4,000
Early Bird
USD $4,500
Standard
0.5×1 Slot (Half Width) New!
0.5×1 Slot — 1000 dies per slot
The half-width (0.5×1) slot delivers a tall, narrow die — ideal for I/O-heavy designs where signals concentrate along the long edges. Perfect for medium-complexity digital or mixed-signal projects, at just over half the cost of a full slot.
- GF180MCU process — 180nm mixed-signal
- Die size: 1.94mm × 5.12mm (9.93 mm²)
- Usable silicon: 9.57 mm² (custom pad ring or none)
- Core area: 4.46 mm² (default pad ring, required for COB)
- Default: 56 I/O pads — max: up to 122 I/O with custom pad ring
- 5 metal layers, MIM capacitors, poly & high-res resistors
- Early Bird pricing available through 30 April 2026
USD $4,000
Early Bird
USD $4,500
Standard
1×0.5 Slot (Half Height) New!
1×0.5 Slot — 1000 dies per slot
The half-height (1×0.5) slot gives you a wide, short die — ideal for designs that benefit from a wider core. Offers slightly more core area than the half-width slot at the same price.
- GF180MCU process — 180nm mixed-signal
- Die size: 3.93mm × 2.53mm (9.94 mm²)
- Usable silicon: 9.61 mm² (custom pad ring or none)
- Core area: 5.02 mm² (default pad ring, required for COB)
- Default: 56 I/O pads — max: up to 108 I/O with custom pad ring
- 5 metal layers, MIM capacitors, poly & high-res resistors
- Early Bird pricing available through 30 April 2026
USD $7,000
Early Bird
USD $7,500
Standard
1×1 Slot (Full)
1×1 Slot — 1000 dies per slot
The full-size slot gives you the largest die area and maximum I/O count. Ideal for complex SoCs, full mixed-signal designs, or projects that need the most routing and core area.
- GF180MCU process — 180nm mixed-signal
- Die size: 3.93mm × 5.12mm (20.12 mm²)
- Usable silicon: 19.65 mm² (custom pad ring or none)
- Core area: 12.92 mm² (default pad ring, required for COB)
- Default: 56 I/O pads — max: up to 168 I/O with custom pad ring
- 5 metal layers, MIM capacitors, poly & high-res resistors
- Early Bird pricing available through 30 April 2026
Enhance Your Order
Get your chips packaged and ready to test, or take home an entire wafer
Learn More
Chip on Board Packaging
Receive your dies wire-bonded onto small PCBs, ready for testing and integration.
- Wire-bonded onto individual PCBs
- Ready to power up and test immediately
- Requires the default pad ring for wire bonding
Add-on to any slot purchase. Requires the default pad ring.
Add to Order
Learn More
Full Undiced Wafer
Take home a complete 200mm wafer with your design alongside other Run 2 projects.
- Complete 200mm wafer, uncut
- Includes all designs from this run
- Perfect for custom dicing or display
Requires slot purchase
Add to OrderDeadlines
wafer.space GF180MCU Run 2
Early Bird Deadline
Lock in early bird pricing for GF180MCU Run 2
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Purchase & Submission Deadline
Final deadline to purchase a slot and submit your GDS
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Complete Timeline
| Milestone | Date | Description |
|---|---|---|
| Campaign Opens | 1 March 2026 | Run 2 slots available for purchase on Crowd Supply |
| Early Bird Deadline | 30 April 2026 @ 11:59 PM AoE | Last day to purchase at early bird pricing |
| Purchase & Submission Deadline | 30 June 2026 @ 11:59 PM AoE | Final deadline to purchase slots and submit GDS files |
| Parts Shipped | Early Q4 2026 | Bare dies and packaged parts shipped to customers |
Ready to design your chip?
Your design. Your silicon. From $4 per die.
Get Started
- Project template — start your design from a working example
- PDK documentation — GF180MCU process design kit reference
- Slot specifications — die dimensions, pad rings, and I/O details
- Community Discord — chat with other designers and get free help
Need Help?
Professional design services are available from independent consultants experienced with the GF180MCU process. Whether you need a full custom design, help with verification, or guidance on your first tapeout, experts are ready to assist.
- Browse professional services — find a consultant for your project
- Join the Discord — free community support and peer help