Tiny Tapeout GF 26b · Die T26B on wafer.space Run 2

Neuromorphic PUF (distinct-tap LFSR arbiter + memristor XOR, GF180)

100 · Security · 1 × 2 tiles

by Prof. Santhosh Sivasubramani, IIT Delhi

Rendered from the layout at 0.33 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Core average
logic cells per mm²
17k (22% of buffer maximum)
Densest 0.1 mm square
logic cells per mm²
26k (35% of buffer maximum)
Core covered by logic55%
Transistor density
transistors per mm²
275k average, 344k in the 0.1 mm square with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.

GF180mcuD digital Physical Unclonable Function: 8 distinct-tap maximal-length 10-bit LFSRs act as synthesizable virtual ring-oscillators, a 6-bit challenge selects a pair, and an arbiter FSM compares their popcounts over a programmable 2^N-cycle window (N in 4..12) to produce a response bit. 64 challenges accumulate into a 64-bit response that can be XORed with a host-loaded memristor vector for dual-entropy mode. SPI-programmable, IRQ output, 25 MHz signoff clock, 1x2 tile (upsized from 1x1: global-placement utilization 103.6% on 1x1).

Size347 × 325 µm (0.113 mm²)
Macrott_um_santhosh_neuro_puf_gf
Filesdocumentation · licence · layout and netlist in Tiny Tapeout GF 26b
Tiles1 × 2 at column 6, row 10 of the tile grid
Mux address100
LanguageVerilog
Clock25 MHz
Built withLibreLane 3.0.3, open_pdks 54435919abff
Transistors31,721
Logic cells1,971 + 4,013 filler and tap cells
Libraries 7t-5V (2k)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this project's area splits between logic cells, filler and tap cells and other.

55%
39%
  • Logic cells 0.06 mm² (55%)
  • Filler and tap cells 0.04 mm² (39%)
  • Other 0.01 mm² (7%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
dffrnq_17t-5V 308D flip-flop with reset
nand2_17t-5V 1752-input NAND gate
clkinv_17t-5V 140Clock inverter
aoi22_17t-5V 135AND-OR-Invert (2x2 inputs)
dlyb_17t-5V 127Delay buffer
mux2_27t-5V 1072-input multiplexer (2x drive)
buf_27t-5V 106Buffer (2x drive)
oai21_17t-5V 72OR-AND-Invert compound gate
oai31_17t-5V 71OR-AND-Invert compound gate
clkbuf_27t-5V 70Clock buffer (2x drive)

Logic density map

161 logic cells, 2,645 transistors 202 logic cells, 2,886 transistors 212 logic cells, 2,711 transistors 26 logic cells, 961 transistors 143 logic cells, 2,786 transistors 243 logic cells, 3,229 transistors 223 logic cells, 3,034 transistors 39 logic cells, 1,042 transistors 181 logic cells, 2,984 transistors 211 logic cells, 3,328 transistors 188 logic cells, 3,111 transistors 26 logic cells, 1,010 transistors 21 logic cells, 530 transistors 55 logic cells, 632 transistors 39 logic cells, 634 transistors 1 logic cells, 198 transistors Densest SRAM-free 0.1 mm square: 265 logic cells 16k 20k 21k 14k 24k 22k 18k 21k 19k

Logic cells per mm² in each 0.1 mm square of the project (counted in the square, scaled up to a mm²). Hatched outlines are SRAM macros; the red outline is the densest 0.1 mm square that avoids them (26k logic cells per mm²), found by sliding a 0.1 mm square over the project in 20 µm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Want your own design on a chip like this one?

Start with a tile: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3. For a die of your own, wafer.space Run 3 takes orders until 9 December 2026.

Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.