Tiny Tapeout GF 26b · Die T26B on wafer.space Run 2

Simple SPI configuration for analog designs

515 · Analog and mixed-signal · 1 × 1 tile

by Alan G

Rendered from the layout at 0.33 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

56 logic cells: too few for density figures, which are given for projects of 1,000 or more.

Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.

Simple 8-bit unidirectional SPI register for external configuration of future analog/mixed-signal designs

Size347 × 161 µm (0.056 mm²)
Macrott_um_spi_config_reg
Filesdocumentation · licence · layout and netlist in Tiny Tapeout GF 26b
Tiles1 × 1 at column 2, row 0 of the tile grid
Mux address515
LanguageVerilog
Built withLibreLane 3.0.3, open_pdks 54435919abff
Transistors11,606
Logic cells56 + 1,316 filler and tap cells
Libraries 7t-5V (56)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this project's area splits between logic cells, filler and tap cells and other.

89%
  • Logic cells 2,200 µm² (4%)
  • Filler and tap cells 0.05 mm² (89%)
  • Other 4,033 µm² (7%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
nor2_17t-5V 162-input NOR gate
dlyb_17t-5V 9Delay buffer
mux2_27t-5V 82-input multiplexer (2x drive)
dffrnq_17t-5V 4D flip-flop with reset
dffrnq_27t-5V 4D flip-flop with reset (2x drive)
dffsnq_17t-5V 4D flip-flop with set
dffsnq_27t-5V 4D flip-flop with set (2x drive)
buf_27t-5V 3Buffer (2x drive)
clkinv_17t-5V 2Clock inverter
and2_17t-5V 12-input AND gate

Want your own design on a chip like this one?

Start with a tile: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3. For a die of your own, wafer.space Run 3 takes orders until 9 December 2026.

Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.