Tiny Tapeout GF 26b · Die T26B on wafer.space Run 2

Detronyx Arithmetic Lab Tile

612 · Other digital · 1 × 1 tile

by Detronyx contributors

Rendered from the layout at 0.33 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Core average
logic cells per mm²
25k (34% of buffer maximum)
Densest 0.1 mm square
logic cells per mm²
32k (43% of buffer maximum)
Core covered by logic74%
Transistor density
transistors per mm²
373k average, 405k in the 0.1 mm square with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.

Register-loaded add/multiply/divide arithmetic lab for TinyTapeout GF

Size347 × 161 µm (0.056 mm²)
Macrott_um_detronyx_arith_lab
Filesdocumentation · licence · layout and netlist in Tiny Tapeout GF 26b
Tiles1 × 1 at column 6, row 18 of the tile grid
Mux address612
LanguageSystemVerilog
Clock50 MHz
Built withLibreLane 3.0.3, open_pdks 54435919abff
Transistors20,890
Logic cells1,427 + 1,785 filler and tap cells
Libraries AS 7t-3.3V (1k)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

3.3 VAS 7t-3.3V standard cells
Gate oxidesThin only (3.3 V) in the design itself

Where the area went

How this project's area splits between logic cells, filler and tap cells and other.

74%
19%
  • Logic cells 0.04 mm² (74%)
  • Filler and tap cells 0.01 mm² (19%)
  • Other 4,033 µm² (7%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
xnor2_2AS 7t-3.3V 1722-input XNOR gate (2x drive)
and2_2AS 7t-3.3V 1482-input AND gate (2x drive)
dfsrtp_2AS 7t-3.3V 141D flip-flop with set and reset (2x drive)
nand2_2AS 7t-3.3V 1292-input NAND gate (2x drive)
mux2_2AS 7t-3.3V 912-input multiplexer (2x drive)
maj3_2AS 7t-3.3V 743-input majority gate (2x drive)
xor2_2AS 7t-3.3V 732-input XOR gate (2x drive)
nor2_2AS 7t-3.3V 682-input NOR gate (2x drive)
ao21_2AS 7t-3.3V 57AND-OR compound gate (2x drive)
or2_2AS 7t-3.3V 442-input OR gate (2x drive)

Logic density map

296 logic cells, 3,846 transistors 223 logic cells, 3,893 transistors 316 logic cells, 4,037 transistors 78 logic cells, 1,711 transistors 149 logic cells, 1,977 transistors 149 logic cells, 2,021 transistors 164 logic cells, 2,346 transistors 52 logic cells, 1,059 transistors Densest SRAM-free 0.1 mm square: 324 logic cells 30k 22k 32k 15k 15k 16k

Logic cells per mm² in each 0.1 mm square of the project (counted in the square, scaled up to a mm²). Hatched outlines are SRAM macros; the red outline is the densest 0.1 mm square that avoids them (32k logic cells per mm²), found by sliding a 0.1 mm square over the project in 20 µm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Want your own design on a chip like this one?

Start with a tile: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3. For a die of your own, wafer.space Run 3 takes orders until 9 December 2026.

Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.