wafer.space Run 2

Expresso Ethernet Chip: 100Mbps Ethernet switch + Heat death of the Universe Beacon - 0.5x0.5 version - Preferred version

CAFE · Communications · ½ × ½ slot

Rendered from the layout at 2.5 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Inside the core
logic cells per mm²
5k (7% of buffer maximum)
over the 1.73 mm² core: what the design itself packed
Inside the seal ring
logic cells per mm²
2k
over all 4.68 mm² of the slot, pad ring included
Densest mm²
logic cells per mm²
8k (10% of buffer maximum)
Core covered by logic15%
Transistor density
transistors per mm²
252k average, 248k in the mm² with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the run: see data and method, and how its designs used the process.

This chip is an open source Ethernet focused ASIC featuring both an 4 port, 100Mbps capable cut-through, unmanaged, Ethernet switch and an Ethernet connected beacon, broadcasting an ethernet frame every second with an uptime count until the heat death of the universe.

Both designs have been validated on an FPGA.

This is the default 0.5x0.5 slot size for this project and is also the version that has been the most worked on.

Die1.94 × 2.53 mm (4.9 mm²)
Core area1.73 mm² inside the pad ring
as set in the design's own layout settings
Inside the seal ring4.68 mm² (the die less its 26 µm seal ring)
Placements1 on the reticle, in slot G2 CAFE on the reticle
Bond pads56
Transistors436,088
Logic cells8,747 + 48,803 filler and tap cells
Libraries 7t-5V (9k)
SRAMNo SRAM

Submission

LicenceCERN-OHL-S-2.0 declared
Repository: CERN-OHL-S-2.0 in LICENSE — agrees
Templatewafer-space/gf180mcu-project-template 1.5.7
How it was checked
Commit and PDK pin The licence and template were read from the repository at commit 80a20dedd124.The template release named above is the one whose Makefile pins the same PDK as that commit (PDK_COMMIT d658698bd8bc).
Chip-on-boardSelected at submission
PrecheckPassed the check it was accepted on, 2026-07-15, gf180mcu-precheck 1.7.2 (from its image)
Passed latest re-run, 2026-08-02, gf180mcu-precheck 1.7.3
step results and logs

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself
I/O librarygf180mcu_fd_io (424 cells)

Where the area went

How this design's area splits between logic cells, filler and tap cells, other and pad ring.

30%
65%
  • Logic cells 0.27 mm² (5%)
  • Filler and tap cells 1.46 mm² (30%)
  • Other 0.01 mm² (<1%)
  • Pad ring 3.18 mm² (65%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
clkbuf_17t-5V 1,977Clock buffer
dffq_17t-5V 1,831D flip-flop (1 bit storage)
nand2_17t-5V 4772-input NAND gate
nor2_17t-5V 4612-input NOR gate
oai21_17t-5V 412OR-AND-Invert compound gate
clkinv_17t-5V 391Clock inverter
aoi22_17t-5V 383AND-OR-Invert (2x2 inputs)
aoi21_17t-5V 267AND-OR-Invert compound gate
and2_17t-5V 2472-input AND gate
clkbuf_87t-5V 206Clock buffer (8x drive)

Logic density map

14 logic cells, 73,419 transistors 1,025 logic cells, 68,501 transistors 3,517 logic cells, 138,115 transistors 4,109 logic cells, 129,558 transistors 74 logic cells, 13,967 transistors 8 logic cells, 12,528 transistors Densest SRAM-free mm²: 7,693 logic cells <1k 1k 4k 4k

Logic cells per mm² in each square millimetre of the die. Hatched outlines are SRAM macros; the red outline is the densest mm² that avoids them (8k logic cells per mm²), found by sliding a 1 mm square over the die in 0.1 mm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Expresso Ethernet switch has been made on 3 shuttles since Jun 2026. Every version, oldest first, with this one in bold:

  1. Jun 2026 · Tiny Tapeout GF 0.3 Until heat death do us part — 2 × 2 tiles, the heat death of the universe beacon
  2. Jun 2026 · Tiny Tapeout GF 26b 100Mbps 3 port Ethernet switch — 2 × 2 tiles 100Mbps Ethernet Accelerator Wrapper — 1 × 2 tiles
  3. Jul 2026 · wafer.space Run 2 CAFE Expresso Ethernet Chip: 100Mbps Ethernet switch + Heat death of the Universe Beacon - 0.5x0.5 version - Preferred version — ½ × ½ slot

Tiny Tapeout tile Google shuttle wafer.space die

Parts of this design are on Tiny Tapeout chips too

Tiny Tapeout puts many small designs on one chip, so trying out a block costs a fraction of a whole die: a cheap way to test one piece of a bigger design before it goes on a die of its own.

Precheck

Before a design is made, the wafer.space platform checks it against the foundry's design rules. CAFE was accepted on this check, and has been checked again since with newer rules.

All 17 steps passed, with 0 KLayout DRC errors, on 2026-07-15.

Every step, and the latest re-run
StepAccepted on
check 576, 2026-07-15, initial, gf180mcu-precheck 1.7.2 (from its image)
PDK open_pdks 1.0.604, LibreLane 5fe3db1
Latest re-run
check 754, 2026-08-02, drc_update, gf180mcu-precheck 1.7.3
PDK open_pdks 1.0.604, LibreLane 5fe3db1
KLayout.ReadLayoutpassedpassed
KLayout.CheckTopLevelpassedpassed
KLayout.CheckSizepassedpassed
KLayout.CheckPadMaskpassedpassed
KLayout.GenerateIDpassedpassed
KLayout.Renderpassedpassed
KLayout.Densitypassedpassed
Checker.KLayoutDensitypassedpassed
KLayout.ZeroAreaPolygonspassedpassed
Checker.KLayoutZeroAreaPolygonspassedpassed
KLayout.Antennapassedpassed
Checker.KLayoutAntennapassedpassed
Magic.DRCpassedpassed
Checker.MagicDRCpassedpassed
KLayout.DRCpassedpassed
Checker.KLayoutDRCpassedpassed
KLayout.WriteLayoutpassedpassed
KLayout DRC errors00
Magic DRC errors (advisory)00
Filessteps · log (gzip)steps · log (gzip)

The steps of the gf180mcu-precheck LibreLane flow, as run by platform.wafer.space. The design was accepted on the newest finished check before it was submitted; later re-runs check the same file with updated rules. KLayout DRC is the sign-off check. Magic DRC is advisory: its count does not stop a design. In the logs, Magic's "Error while reading cell" lines about fill cells are messages from its reader, not check failures.

Want a chip of your own like this one?

wafer.space Run 3 takes orders until 9 December 2026. Or start smaller with Tiny Tapeout: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3.