Tiny Tapeout GF 26b · Die T26B on wafer.space Run 2

Multi-Protocol Communication Controller

487 · Communications · 1 × 1 tile

by Chirantan J Tilavalli

Rendered from the layout at 0.33 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

110 logic cells: too few for density figures, which are given for projects of 1,000 or more.

Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.

Supports UART, SPI and I2C transmission modes using a compact single-module design.

Size347 × 161 µm (0.056 mm²)
Macrott_um_multi_protocol
Filesdocumentation · licence · layout and netlist in Tiny Tapeout GF 26b
Tiles1 × 1 at column 7, row 17 of the tile grid
Mux address487
LanguageVerilog
Clock1 MHz
Built withLibreLane 3.0.3, open_pdks 54435919abff
Transistors11,840
Logic cells110 + 1,303 filler and tap cells
Libraries 7t-5V (110)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this project's area splits between logic cells, filler and tap cells and other.

86%
  • Logic cells 3,767 µm² (7%)
  • Filler and tap cells 0.05 mm² (86%)
  • Other 4,033 µm² (7%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
dffrnq_17t-5V 11D flip-flop with reset
dlyb_17t-5V 11Delay buffer
clkinv_17t-5V 10Clock inverter
buf_37t-5V 8Buffer (3x drive)
clkbuf_17t-5V 8Clock buffer
dffrnq_27t-5V 8D flip-flop with reset (2x drive)
nor3_17t-5V 73-input NOR gate
nand2_17t-5V 62-input NAND gate
clkbuf_167t-5V 5Clock buffer (16x drive)
mux2_27t-5V 52-input multiplexer (2x drive)

Want your own design on a chip like this one?

Start with a tile: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3. For a die of your own, wafer.space Run 3 takes orders until 9 December 2026.

Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.