Tiny Tapeout GF 26b · Die T26B on wafer.space Run 2

Music for ASICs

103 · Other digital · 1 × 2 tiles

by d5smith

Rendered from the layout at 0.33 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Core average
logic cells per mm²
20k (27% of buffer maximum)
Densest 0.1 mm square
logic cells per mm²
28k (37% of buffer maximum)
Core covered by logic53%
Transistor density
transistors per mm²
269k average, 312k in the 0.1 mm square with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.

Autonomous generative ambient music chip using LFSR composition, scale quantization, and DDS synthesis

Size347 × 325 µm (0.113 mm²)
Macrott_um_d5smith_mfa
Filesdocumentation · licence · layout and netlist in Tiny Tapeout GF 26b
Tiles1 × 2 at column 7, row 11 of the tile grid
Mux address103
LanguageVerilog
Clock25 MHz
Built withLibreLane 3.0.3, open_pdks 54435919abff
Transistors31,053
Logic cells2,360 + 4,386 filler and tap cells
Libraries 7t-5V (2k)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this project's area splits between logic cells, filler and tap cells and other.

53%
40%
  • Logic cells 0.06 mm² (53%)
  • Filler and tap cells 0.05 mm² (40%)
  • Other 0.01 mm² (7%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
nand2_17t-5V 3122-input NAND gate
nor2_17t-5V 2772-input NOR gate
dffq_17t-5V 246D flip-flop (1 bit storage)
aoi21_17t-5V 153AND-OR-Invert compound gate
oai21_17t-5V 119OR-AND-Invert compound gate
clkinv_17t-5V 106Clock inverter
xor2_17t-5V 962-input XOR gate
and2_17t-5V 862-input AND gate
dlyb_17t-5V 81Delay buffer
nand3_17t-5V 793-input NAND gate

Logic density map

144 logic cells, 2,445 transistors 216 logic cells, 2,694 transistors 171 logic cells, 2,690 transistors 70 logic cells, 1,082 transistors 188 logic cells, 2,627 transistors 264 logic cells, 2,898 transistors 254 logic cells, 3,275 transistors 98 logic cells, 1,226 transistors 251 logic cells, 2,891 transistors 230 logic cells, 2,898 transistors 221 logic cells, 2,937 transistors 95 logic cells, 1,217 transistors 46 logic cells, 610 transistors 39 logic cells, 646 transistors 48 logic cells, 622 transistors 25 logic cells, 295 transistors Densest SRAM-free 0.1 mm square: 278 logic cells 14k 22k 17k 19k 26k 25k 25k 23k 22k

Logic cells per mm² in each 0.1 mm square of the project (counted in the square, scaled up to a mm²). Hatched outlines are SRAM macros; the red outline is the densest 0.1 mm square that avoids them (28k logic cells per mm²), found by sliding a 0.1 mm square over the project in 20 µm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Want your own design on a chip like this one?

Start with a tile: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3. For a die of your own, wafer.space Run 3 takes orders until 9 December 2026.

Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.