Tiny Tapeout GF 26b · Die T26B on wafer.space Run 2

PDM Voice Activity Detector

610 · Other digital · 1 × 1 tile

by Kevin

Rendered from the layout at 0.33 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Core average
logic cells per mm²
24k (32% of buffer maximum)
Densest 0.1 mm square
logic cells per mm²
29k (38% of buffer maximum)
Core covered by logic61%
Transistor density
transistors per mm²
274k average, 300k in the 0.1 mm square with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.

A one-tile spectral PDM voice activity score.

Size347 × 161 µm (0.056 mm²)
Macrott_um_antimatter15_pdm_vad
Filesdocumentation · licence · layout and netlist in Tiny Tapeout GF 26b
Tiles1 × 1 at column 5, row 18 of the tile grid
Mux address610
LanguageVerilog
Clock1 MHz
Built withLibreLane 3.0.3, open_pdks 54435919abff
Transistors15,352
Logic cells1,357 + 2,154 filler and tap cells
Libraries 7t-5V (1k)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this project's area splits between logic cells, filler and tap cells and other.

61%
32%
  • Logic cells 0.03 mm² (61%)
  • Filler and tap cells 0.02 mm² (32%)
  • Other 4,033 µm² (7%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
nand2_17t-5V 1942-input NAND gate
oai21_17t-5V 118OR-AND-Invert compound gate
nor2_17t-5V 1132-input NOR gate
dffq_17t-5V 106D flip-flop (1 bit storage)
xor2_17t-5V 942-input XOR gate
aoi21_17t-5V 89AND-OR-Invert compound gate
clkinv_17t-5V 75Clock inverter
dlyb_17t-5V 47Delay buffer
xnor2_17t-5V 412-input XNOR gate
and2_17t-5V 402-input AND gate

Logic density map

243 logic cells, 2,719 transistors 258 logic cells, 2,868 transistors 266 logic cells, 2,836 transistors 98 logic cells, 1,219 transistors 129 logic cells, 1,544 transistors 157 logic cells, 1,722 transistors 137 logic cells, 1,677 transistors 69 logic cells, 767 transistors Densest SRAM-free 0.1 mm square: 286 logic cells 24k 26k 27k 13k 16k 14k

Logic cells per mm² in each 0.1 mm square of the project (counted in the square, scaled up to a mm²). Hatched outlines are SRAM macros; the red outline is the densest 0.1 mm square that avoids them (29k logic cells per mm²), found by sliding a 0.1 mm square over the project in 20 µm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Want your own design on a chip like this one?

Start with a tile: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3. For a die of your own, wafer.space Run 3 takes orders until 9 December 2026.

Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.