Tiny Tapeout GF 26b · Die T26B on wafer.space Run 2

ECDSA Verification

192 · Other digital · 1 × 1 tile

by Lyra

Rendered from the layout at 0.33 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

26 logic cells: too few for density figures, which are given for projects of 1,000 or more.

Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.

Simplified ECDSA digital signature verification module using Verilog

Size347 × 161 µm (0.056 mm²)
Macrott_um_ecdsa_verify
Filesdocumentation · licence · layout and netlist in Tiny Tapeout GF 26b
Tiles1 × 1 at column 4, row 7 of the tile grid
Mux address192
LanguageVerilog
Clock10 MHz
Built withLibreLane 3.0.3, open_pdks 54435919abff
Transistors11,430
Logic cells26 + 1,259 filler and tap cells
Libraries 7t-5V (26)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this project's area splits between logic cells, filler and tap cells and other.

92%
  • Logic cells 696 µm² (1%)
  • Filler and tap cells 0.05 mm² (92%)
  • Other 4,033 µm² (7%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
dlyb_17t-5V 10Delay buffer
buf_27t-5V 7Buffer (2x drive)
clkinv_17t-5V 2Clock inverter
nand2_17t-5V 22-input NAND gate
buf_47t-5V 1Buffer (4x drive)
dffrnq_47t-5V 1D flip-flop with reset (4x drive)
nand4_17t-5V 14-input NAND gate
oai21_17t-5V 1OR-AND-Invert compound gate
or4_17t-5V 14-input OR gate

Want your own design on a chip like this one?

Start with a tile: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3. For a die of your own, wafer.space Run 3 takes orders until 9 December 2026.

Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.