Tiny Tapeout GF 0.2Die TTPG on wafer.space Run 1: the power-gated edition

52 projects on one chip, measured one by one and as a whole die

Buy this chipPut your design on the next oneAll its projects on tinytapeout.com

What was built

The chip as a whole: what its projects add up to.

This is the power-gated edition of Tiny Tapeout GF 0.2: it can switch off the power to the projects that are not selected. The same 52 projects were also made on the standard edition, without the power switches.

52

Projects

on the chip

52

Open source

with a public repository

2.8M

Transistors

across the unique designs

197k

Logic cells

gates and flip-flops

Counted inside the projects only, so these totals are smaller than the die's own figures on its run's page: the pads, Tiny Tapeout's multiplexer and controller, the power switches and the fill are left out.

Get this chip, or make your own

Tiny Tapeout puts many small designs on one chip. Start with a tile, then come back with a whole die.

1
Get this chip

It comes on a board you can plug in, with every project on it ready to try.

Buy this chip
2
Put your design on the next one

Tiny Tapeout GF 26c and 26d take projects until 7 December 2026, to be made on wafer.space Run 3.

Submit a project
3
Make a whole chip of your own

When a design outgrows a few tiles, it can have a die to itself on wafer.space Run 3: orders close 9 December 2026.

Reserve a slot

The die

Every design rendered from the layout at the same scale and placed where it sits on the 3.9 × 5.1 mm die. Point at a project to see its name, and select it for its details.Every project is listed further down.

Project sizes

How many tiles each project took. A tile is the smallest piece of a Tiny Tapeout chip you can submit a design to.

1 × 1 tiles26
1 × 2 tiles13
2 × 2 tiles4
3 × 2 tiles2
3 × 4 tiles4
4 × 2 tiles2
4 × 4 tiles1
Total52

Layout on GitHub

Shuttle status

Two schedules meet here: Tiny Tapeout collects the projects and builds the die, then wafer.space manufactures it on wafer.space Run 1 and ships the parts.

Done so far

  • Tiny Tapeout 24 November 2025 Tiny Tapeout GF 0.2 submissions close Last day to submit a project to this Tiny Tapeout shuttle
  • wafer.space 28 November 2025, 23:59 AoE Purchase deadline Final deadline to purchase manufacturing slots, for whole-die slots on the run (not Tiny Tapeout projects)
  • wafer.space 3 December 2025, 23:59 AoE Design submission Final deadline to submit GDS files for fabrication
  • Tiny Tapeout 11 December 2025 Tiny Tapeout GF 0.2 tapeout release Tiny Tapeout publishes the die's layout (tapeout-ws2512-powergate) and sends it to wafer.space
  • wafer.space 8 January 2026 Tape-out to GlobalFoundries GDS files delivered to GlobalFoundries for fabrication
  • wafer.space 6 April 2026 Wafers returned Wafers back from GlobalFoundries
  • wafer.space 10 April 2026 First wafers diced The first wafers cut into individual dies
  • wafer.space 17 April 2026 Remaining wafers diced The rest of the wafers diced
  • wafer.space 20 April 2026 First dies sorted Dies picked from the first wafers for the first shipments
  • wafer.space 21 April 2026 First bare dies shipped Initial bare dies shipped to customers
  • wafer.space 25 April 2026 First packaged parts shipped Initial chip-on-board packaged parts shipped
  • wafer.space 4 May 2026 Bare dies shipped Sorted dies from the main batch of wafers shipped

Still to come

  • Today, 24 October 2026
  • wafer.space 31 October 2026 (expected) Packaged parts shipped Chip-on-board packaged parts from the main batch of wafers shipped
  • wafer.space 5 November 2026 (expected) Last bare dies shipped Sorted dies from the last wafers shipped
  • wafer.space 5 December 2026 (expected) Last packaged parts shipped Chip-on-board packaged parts from the last wafers shipped

Missed this one? Tiny Tapeout GF 26c and 26d take projects until 7 December 2026: submit a project.

From the wafer.space run schedule and the Tiny Tapeout GF 0.2 repository.

How people used their silicon

Where the area of 52 projects (10 mm² of silicon) actually went

58%
38%
  • Logic cells 58% — gates and flip-flops doing the design's actual work
  • Filler and tap cells 38% — inserted by the tools to keep rows continuous and wells tied
  • Other 4% — routing channels, analog and custom layout, power grid and empty space

Standard cell libraries

The ready-made gate libraries the designs were built from: how many tracks tall each cell is, and the voltage it runs at.

Standard cell libraryLogic cellsShare
7t-5V gf180mcu_fd_sc_mcu7t5v0 194k 98%
9t-5V gf180mcu_fd_sc_mcu9t5v0 4k 2%

Area budget of every design

Each bar is one project, split the same way as above. Sorted by how much of the project is logic.

Show all 52 projects

What fits on 1 mm² of GF180MCU silicon?

Theoretical maximum against what designers achieved

The maximum packs one cell type edge to edge with no room for wiring. Real designs need the wiring. Each box gives the most of a cell that fits with any GF180MCU library, then with the libraries this chip used.

~114k

Inverters per mm²

GF180MCU maximum,
with AS 7t-3.3V inv_2

With this chip's libraries:

7t-5V: 114k inv_1

9t-5V: 89k inv_1

~91k

NAND gates per mm²

GF180MCU maximum,
with 7t-5V nand2_1

With this chip's libraries:

7t-5V: 91k nand2_1

9t-5V: 71k nand2_1

~76k

Buffers per mm²

GF180MCU maximum,
with AS 7t-3.3V buff_2

With this chip's libraries:

7t-5V: 76k buf_1

9t-5V: 59k buf_1

~17k

Flip-flops per mm²

GF180MCU maximum,
with AS 7t-3.3V dfxtp_2

With this chip's libraries:

7t-5V: 16k dffq_1

9t-5V: 13k dffq_1

28k

Best core average

logic cells/mm² of core — 37% of the buffer maximum

SCµM-BLE-RX

42k

Densest 0.1 mm square

logic cells per mm² — 55% of the buffer maximum

megabytebeat

21k

Typical project

median logic cells/mm² of core across 36 digital projects (1,000 or more logic cells)

61% of the core covered by logic cells

Percentages compare with the buffer maximum for each design's own library: buffers are among the smallest and most common logic cells, so a design made only of buffers, packed edge to edge with no wiring, would reach 100%.

Sizing your own design

What each tile size held on this chip, and what it would hold at its densities

Logic cells in its digital projects1,000 or more logic cells Logic cells at this chip's density Theoretical maximum, 7t-5V cells
Tiles Size  Core area Projects  Most Median  Typical21k / mm²Best28k / mm² NAND gatesnand2_1Flip-flopsdffq_1
1 × 10.35 × 0.16 mm 0.06 mm²26 1.5k1.2k 1.2k 1.6k 5.1k 880
1 × 20.35 × 0.33 mm 0.12 mm²13 2.9k2.2k 2.4k 3.3k 10.5k 1.8k
2 × 20.71 × 0.33 mm 0.23 mm²4 4.9k4.3k 4.9k 6.7k 21.3k 3.7k
3 × 21.08 × 0.33 mm 0.36 mm²2 8.8k7.3k 7.4k 10.1k 32.5k 5.6k
3 × 41.08 × 0.74 mm 0.80 mm²4 22.7k18.7k 16.6k 22.7k 72.8k 12.6k
4 × 21.44 × 0.33 mm 0.48 mm²2 11.0k10.4k 9.9k 13.5k 43.3k 7.5k
4 × 41.44 × 0.74 mm 1.07 mm²1 20.3k20.3k 22.2k 30.3k 97.1k 16.7k

Swipe the table sideways for more columns.

Core area is the whole project. "Typical" and "best" multiply the core area by this chip's median and best core densities; SRAM and analog blocks take their area out of that. The theoretical maxima fill the core with nothing but that one cell of 7t-5V, the library most used on this chip, edge to edge with no routing.

Pick the tile size your design needs when you submit it to the next Tiny Tapeout chip, by 7 December 2026.

Logic density of every digital design

A digital project here is one with 1,000 or more logic cells. Solid bar: average over the core. Outlined bar: the densest 0.1 mm square outside SRAM, per mm² (a dash where memory covers most of the design). The scale ends at the buffer theoretical maximum (76k cells/mm²). The numbers are core / densest, in logic cells per mm².

Show all 36 digital projects
Every digital project's densities as a table
ProjectTilesLibraryLogic cells Inside core
per mm²
Densest 0.1 mm square
per mm²
Core coveredCore
mm²
SCµM-BLE-RX 101 3 × 47t-5V 22,709 28,415 39,300 74% 0.80*
Simon Says memory game 519 1 × 17t-5V 1,507 26,911 38,200 70% 0.06*
WokwiPWM 547 1 × 17t-5V 1,481 26,446 32,600 69% 0.06*
USB CDC (Serial) Device 130 1 × 27t-5V 2,943 25,481 34,000 78% 0.12*
TinyQV RISC-V SoC 039 3 × 47t-5V 20,084 25,130 36,900 74% 0.80*
PRISM 8 with TinySnake 579 1 × 17t-5V 1,401 25,018 32,900 69% 0.06*
megabytebeat 391 3 × 27t-5V 8,785 24,649 42,000 62% 0.36*
Classic 8-bit era Programmable Sound Generator SN76489 513 1 × 17t-5V 1,380 24,643 35,600 69% 0.06*
Notre Dame - Lockpick Game TT Example 288 1 × 27t-5V 2,722 23,567 28,800 71% 0.12*
2x2 MAC Systolic array with DFT 129 1 × 27t-5V 2,711 23,472 35,500 64% 0.12*
Simple RISC-V 359 4 × 27t-5V 11,000 23,148 32,800 78% 0.48*
VGA Nyan Cat 199 1 × 27t-5V 2,662 23,048 34,700 63% 0.12*
Zedulo TestChip1 032 1 × 17t-5V 1,242 22,179 31,000 69% 0.06*
Video mode tester 611 1 × 17t-5V 1,234 22,036 27,100 73% 0.06*
Flame demo 545 1 × 17t-5V 1,230 21,964 30,900 61% 0.06*
LISA 8-Bit Microcontroller 197 3 × 47t-5V 17,231 21,560 32,300 62% 0.80*
Simon's Caterpillar 103 1 × 27t-5V 2,486 21,524 31,600 62% 0.12*
Zilog Z80 455 2 × 27t-5V 4,918 20,990 33,500 61% 0.23*
Silly-Faust 102 4 × 27t-5V 9,814 20,652 35,800 56% 0.48*
raybox-zero TTGF0p2 edition 135 3 × 47t-5V 16,500 20,646 35,100 59% 0.80*
PVTMonitorSuite 551 1 × 17t-5V 1,123 20,054 31,500 55% 0.06*
2048 sliding tile puzzle game (VGA) 194 2 × 27t-5V 4,680 19,974 38,100 54% 0.23*
ROTFPGA v2 481 1 × 27t-5V 2,269 19,645 30,900 53% 0.12*
VGA Tiny Logo 515 1 × 17t-5V 1,095 19,554 34,700 51% 0.06*
wafer.space Logo VGA Screensaver 033 1 × 27t-5V 2,228 19,290 27,300 53% 0.12*
KianV uLinux SoC 295 4 × 47t-5V 20,266 19,018 28,000 58% 1.07*
Dog Battle Game 549 1 × 17t-5V 1,047 18,696 27,200 48% 0.06*
Notre Dame - CSE 30342 - DIC - Advanced FSM Final Project Example 358 1 × 27t-5V 2,044 17,697 35,400 43% 0.12*
Asicle v2 451 2 × 27t-5V 4,018 17,149 33,900 53% 0.23*
Wildcat RISC-V 038 3 × 27t-5V 5,867 16,462 33,900 48% 0.36*
easy PAL 198 1 × 27t-5V 1,890 16,364 26,200 61% 0.12*
VGA Drop (audio/visual demo) 134 2 × 29t-5V 3,625 15,472 27,200 45% 0.23*
Quickscope 196 1 × 27t-5V 1,718 14,874 29,400 52% 0.12*
LEDs Racer 384 1 × 27t-5V 1,315 11,385 31,300 32% 0.12*
CAN Controller for Rocket 454 1 × 27t-5V 1,218 10,545 26,400 36% 0.12*
Frequency Counter SSD1306 OLED 385 1 × 27t-5V 1,157 10,017 30,000 27% 0.12*

The projects

Every project on this chip: an index, then grouped by what it does. Select one for its layout, its measurements and any die photographs.

Project index

All 52 projects by their address on the chip's multiplexer, with how many tiles each took and how much logic it packs.

AddressProjectAuthorTiles What it isLogic cells Cells per mm²
000 Chip ROM Uri Shaked 1 × 1 Other digital 236 4k
001 Tiny Tapeout Factory Test Tiny Tapeout 1 × 1 Test structures 90 2k
032 Zedulo TestChip1 Zedulo 1 × 1 Other digital 1,242 22k
033 wafer.space Logo VGA Screensaver Uri Shaked 1 × 2 Art and logos 2,228 19k
038 Wildcat RISC-V Martin Schoeberl 3 × 2 RISC-V and CPUs 5,867 16k
039 TinyQV RISC-V SoC Michael Bell 3 × 4 RISC-V and CPUs 20,084 25k
101 SCµM-BLE-RX Dingyu Zhou 3 × 4 Communications 22,709 28k
102 Silly-Faust Louis Ledoux, Cochard Pierre 4 × 2 Other digital 9,814 21k
103 Simon's Caterpillar htfab 1 × 2 Other digital 2,486 22k
128 VGA clock Matt Venn 1 × 1 Retro computing 860 15k
129 2x2 MAC Systolic array with DFT Julia Desmazes 1 × 2 Other digital 2,711 23k
130 USB CDC (Serial) Device Uri Shaked 1 × 2 Communications 2,943 25k
134 VGA Drop (audio/visual demo) ReJ aka Renaldas Zioma, eriQue aka Erik Hemming, Matthias Kampa 2 × 2 Retro computing 3,625 15k
135 raybox-zero TTGF0p2 edition algofoogle (Anton Maurovic) 3 × 4 Retro computing 16,500 21k
194 2048 sliding tile puzzle game (VGA) Uri Shaked 2 × 2 Games 4,680 20k
196 Quickscope Frans Skarman 1 × 2 Other digital 1,718 15k
197 LISA 8-Bit Microcontroller Ken Pettit 3 × 4 RISC-V and CPUs 17,231 22k
198 easy PAL Ken Pettit 1 × 2 Other digital 1,890 16k
199 VGA Nyan Cat Andy Sloane 1 × 2 Retro computing 2,662 23k
288 Notre Dame - Lockpick Game TT Example Matthew Morrison 1 × 2 Games 2,722 24k
295 KianV uLinux SoC Hirosh Dabui 4 × 4 RISC-V and CPUs 20,266 19k
358 Notre Dame - CSE 30342 - DIC - Advanced FSM Final Project Example Matthew Morrison 1 × 2 Other digital 2,044 18k
359 Simple RISC-V kinako71-2 4 × 2 RISC-V and CPUs 11,000 23k
384 LEDs Racer KerCrafter 1 × 2 Games 1,315 11k
385 Frequency Counter SSD1306 OLED Pawel Sitarz (embelon) 1 × 2 Other digital 1,157 10k
391 megabytebeat proppy 3 × 2 Other digital 8,785 25k
451 Asicle v2 htfab 2 × 2 Other digital 4,018 17k
454 CAN Controller for Rocket Noritsuna Imamura 1 × 2 Communications 1,218 11k
455 Zilog Z80 ReJ aka Renaldas Zioma 2 × 2 Retro computing 4,918 21k
481 ROTFPGA v2 htfab 1 × 2 Other digital 2,269 20k
483 7-Segment Digital Desk Clock Samuel Ellicott 1 × 1 Other digital 746 13k
485 MarcoPolo Javier Munoz Saez 1 × 1 First designs 726 13k
487 Linear Timecode (LTC) generator Thomas Flummer 1 × 1 Other digital 777 14k
513 Classic 8-bit era Programmable Sound Generator SN76489 ReJ aka Renaldas Zioma 1 × 1 Other digital 1,380 25k
515 VGA Tiny Logo Renaldas Zioma 1 × 1 Art and logos 1,095 20k
517 Ring Oscillator (5 inverter) Darryl Miles 1 × 1 Other digital 61 1k
519 Simon Says memory game Uri Shaked 1 × 1 Games 1,507 27k
545 Flame demo Konrad Beckmann & Linus Mårtensson 1 × 1 Other digital 1,230 22k
547 WokwiPWM Ken Pettit 1 × 1 Other digital 1,481 26k
549 Dog Battle Game Sophus Andreassen 1 × 1 Games 1,047 19k
551 PVTMonitorSuite Susumu Yamazaki 1 × 1 Other digital 1,123 20k
577 PILIPINAS_IC Alexander Co Abad and Dino Dominic Ligutan 1 × 1 Other digital 82 1k
579 PRISM 8 with TinySnake Ken Pettit 1 × 1 Games 1,401 25k
581 Register bank accessible through SPI and I2C Caio Alonso da Costa 1 × 1 Other digital 897 16k
583 Cell mux htfab 1 × 1 Other digital 677 12k
609 Super-Simple-SPI-CPU James Ashie Kotey 1 × 1 RISC-V and CPUs 761 14k
610 Example of Bad Synchronizer Darryl Miles project from Eric Smith 1 × 1 Other digital 62 1k
611 Video mode tester htfab 1 × 1 Retro computing 1,234 22k
612 One Bit PUF Yimin Gao and Ceylan Morgul 1 × 1 Security 977 17k
613 DDR throughput and flop aperture test Darryl Miles project from Eric Smith 1 × 1 Other digital 90 2k
614 Ring osc on VGA algofoogle (Anton Maurovic) 1 × 1 Retro computing 473 8k
615 GF180MCU loopback tile with input skew measurement Darryl Miles project from Eric Smith 1 × 1 Other digital 81 1k

Swipe the table sideways for more columns.

Designs that grew

Some designs on this chip have been made many times, on earlier and later Tiny Tapeout chips, and several now have a whole die of their own on a wafer.space run. The ringed marker is this chip.

Tiny Tapeout tile Google shuttle wafer.space die this chip
Each marker is one version of the design: hover over it or focus it for details, and select it to open its page. On a phone, the table below lists every one.

As a table
DesignMade onWhenVersionSize
TinyQV RISC-V SoC Tiny Tapeout 6Apr 2024 TinyQV RISC-V SoC2 × 2 tiles
Tiny Tapeout IHP 0.2Nov 2024 TinyQV RISC-V SoC2 × 2 tiles
Tiny Tapeout IHP 25aMar 2025 TinyQV RISC-V SoC3 × 2 tiles
Tiny Tapeout IHP 25bSep 2025 TinyQV - Crowdsourced RISC-V SoC5 × 4 tiles
Tiny Tapeout SKY 25aSep 2025 TinyQV 'Asteroids' - Crowdsourced RISC-V SoC; TinyQV 'Berzerk' - Crowdsourced RISC-V SoC8 × 4 tiles, 4 × 4 tiles
Tiny Tapeout SKY 25bNov 2025 TinyQV RISC-V SoC3 × 2 tiles
Tiny Tapeout GF 0.1Nov 2025 TinyQV RISC-V SoCin a shared block
Tiny Tapeout GF 0.2Nov 2025 TinyQV RISC-V SoC3 × 4 tiles
wafer.space Run 1Dec 2025 TQVA TinyQV - Crowdsourced RISC-V SoC; TQVB TinyQV - Crowdsourced RISC-V SoC (0.5x1); TQVC TinyQV - Crowdsourced RISC-V SoC (1x0.5)TQVA ½ × ½ slot, TQVB ½ × 1 slot, TQVC 1 × ½ slot
Tiny Tapeout GF 0.3Jun 2026 TinyQV RISC-V SoC4 × 2 tiles
wafer.space Run 2Jul 2026 TQVA TinyQV - Crowdsourced RISC-V SoC; TQVC TinyQV - Crowdsourced RISC-V SoC (1x0.5); TQVD TinyQV - RISC-V SoC with HDMI output; TQVE TinyQV - RISC-V SoC with experimental pad setupTQVA ½ × ½ slot, TQVC 1 × ½ slot, TQVD ½ × ½ slot, TQVE ½ × ½ slot
KianV RISC-V Linux SoC Tiny Tapeout 5Nov 2023 KianV uLinux SoC8 × 2 tiles
Tiny Tapeout 6Apr 2024 KianV uLinux SoC8 × 2 tiles
Tiny Tapeout 7Jun 2024 KianV RISC-V RV32E Baremetal SoC3 × 2 tiles
Tiny Tapeout IHP 0.2Nov 2024 KianV RISC-V RV32E Baremetal SoC4 × 2 tiles
Tiny Tapeout GF 0.1Nov 2025 KianV uLinux SoCin a shared block
Tiny Tapeout GF 0.2Nov 2025 KianV uLinux SoC4 × 4 tiles
wafer.space Run 1Dec 2025 KIAN KianV: A 32-bit RISC-V Linux SoC taped out on GF180MCU1 × 1 slot
Tiny Tapeout IHP 26aMar 2026 KianV SV32 TT Linux SoC8 × 4 tiles
Tiny Tapeout GF 0.3Jun 2026 KianV uLinux SoC4 × 4 tiles
wafer.space Run 2Jul 2026 KIAN KianV: A 32-bit RISC-V Linux SoC taped out on GF180MCU Run 21 × 1 slot
raybox-zero Tiny Tapeout 4Sep 2023 raybox-zero4 × 2 tiles
Tiny Tapeout 7Jun 2024 raybox-zero TT07 edition6 × 2 tiles
Tiny Tapeout IHP 0.2Nov 2024 raybox-zero TTIHP0p2 edition4 × 2 tiles
Tiny Tapeout GF 0.1Nov 2025 raybox-zero TT07 editionin a shared block
Tiny Tapeout GF 0.2Nov 2025 raybox-zero TTGF0p2 edition3 × 4 tiles
Tiny Tapeout IHP 0.4Mar 2026 raybox-zero TTIHP0p4 edition6 × 2 tiles
wafer.space Run 2Jul 2026 AMM1 raybox-zero wafer.space run 2 half height1 × ½ slot
Open-source Z80 Tiny Tapeout 7Jun 2024 Zilog Z802 × 2 tiles
Tiny Tapeout IHP 0.2Nov 2024 Zilog Z802 × 2 tiles
Tiny Tapeout 9Nov 2024 Zilog Z802 × 2 tiles
Tiny Tapeout IHP 25aMar 2025 Zilog Z802 × 2 tiles
Tiny Tapeout GF 0.2Nov 2025 Zilog Z802 × 2 tiles
wafer.space Run 1Dec 2025 HZ80 FOSSi open-source replacement for Z80 classic 8-bit CPU (0.5 x 1 slot); RZ80 FOSSi open-source replacement for Z80 classic 8-bit CPUHZ80 ½ × 1 slot, RZ80 1 × 1 slot
wafer.space Run 2Jul 2026 HZ80 FOSSi open-source replacement for Z80 classic 8-bit CPU (0.5 x 1 slot); QZ80 FOSSi open-source replacement for Z80 classic 8-bit CPU (0.5 x 0.5 slot)HZ80 ½ × 1 slot, QZ80 ½ × ½ slot

Other digital 25

Show all 25 in Other digital

Retro computing 7

Games 6

RISC-V and CPUs 6

Communications 3

Art and logos 2

First designs 1

Security 1

Test structures 1

Die TTPG on wafer.space Run 1

The die as a whole, measured like every other design on its run: its size, pads, process features, density, precheck and photographs. See every design on wafer.space Run 1

Rendered from the layout at 2.5 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Inside the core
logic cells per mm²
16k (21% of buffer maximum)
over the 12.90 mm² core: what the design itself packed
Inside the seal ring
logic cells per mm²
10k
over all 19.65 mm² of the slot, pad ring included
Densest mm²
logic cells per mm²
26k (34% of buffer maximum)
Core covered by logic46%
Transistor density
transistors per mm²
252k average, 310k in the mm² with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the run: see data and method, and how its designs used the process.

Die3.93 × 5.12 mm (20.1 mm²)
Core area12.90 mm² inside the pad ring
the project template's, 442 µm in from each edge
Inside the seal ring19.65 mm² (the die less its 26 µm seal ring)
Placements1 on the reticle, in slot D4 TTPG on the reticle
Bond pads74
Transistors3,254,189
Logic cells203,780 + 366,311 filler and tap cells
Libraries 7t-5V (200k), 9t-5V (4k)
SRAMNo SRAM

Submission

LicenceApache-2.0 declared
Repository: Apache-2.0 in LICENSE — agrees
How it was checked
Commit and PDK pin The licence and template were read from the repository at commit 4150e9654790.
Chip-on-boardNot selected at submission
PrecheckPassed the check it was accepted on, 2025-12-11
Passed latest re-run, 2026-08-02, gf180mcu-precheck 1.7.3
step results and logs

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

3.3 V18,377 custom transistors
5 V7t-5V standard cells, 9t-5V standard cells
Gate oxidesThin (3.3 V) and thick (5 V/6 V) in the design itself
I/O librarygf180mcu_ocd_io (1140 cells)

Where the area went

How this design's area splits between logic cells, filler and tap cells, other and pad ring.

30%
25%
10%
36%
  • Logic cells 5.96 mm² (30%)
  • Filler and tap cells 4.98 mm² (25%)
  • Other 1.96 mm² (10%)
  • Pad ring 7.22 mm² (36%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
nand2_17t-5V 23,8172-input NAND gate
oai21_17t-5V 14,104OR-AND-Invert compound gate
nor2_17t-5V 13,2142-input NOR gate
aoi21_17t-5V 11,441AND-OR-Invert compound gate
dffq_17t-5V 10,148D flip-flop (1 bit storage)
xor2_17t-5V 7,6142-input XOR gate
buf_27t-5V 7,068Buffer (2x drive)
buf_47t-5V 6,477Buffer (4x drive)
dffq_47t-5V 6,262D flip-flop (1 bit storage, 4x drive)
mux2_27t-5V 5,9902-input multiplexer (2x drive)

Logic density map

5,270 logic cells, 75,737 transistors 7,591 logic cells, 119,080 transistors 6,587 logic cells, 130,823 transistors 3,773 logic cells, 66,891 transistors 9,562 logic cells, 150,184 transistors 13,579 logic cells, 230,064 transistors 18,115 logic cells, 275,411 transistors 6,241 logic cells, 115,051 transistors 9,251 logic cells, 142,419 transistors 12,874 logic cells, 234,544 transistors 18,536 logic cells, 272,405 transistors 7,231 logic cells, 128,445 transistors 11,086 logic cells, 165,480 transistors 18,123 logic cells, 260,813 transistors 24,376 logic cells, 296,206 transistors 7,341 logic cells, 123,751 transistors 5,218 logic cells, 94,370 transistors 10,192 logic cells, 156,935 transistors 7,144 logic cells, 149,162 transistors 1,690 logic cells, 65,572 transistors 0 logic cells, 176 transistors 0 logic cells, 256 transistors 0 logic cells, 255 transistors 0 logic cells, 159 transistors Densest SRAM-free mm²: 26,088 logic cells 5k 8k 7k 4k 10k 14k 18k 6k 9k 13k 19k 7k 11k 18k 24k 7k 5k 10k 7k 2k

Logic cells per mm² in each square millimetre of the die. Hatched outlines are SRAM macros; the red outline is the densest mm² that avoids them (26k logic cells per mm²), found by sliding a 1 mm square over the die in 0.1 mm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Precheck

Before a design is made, the wafer.space platform checks it against the foundry's design rules. TTPG was accepted on this check, and has been checked again since with newer rules.

All 16 steps passed, with 0 KLayout DRC errors, on the latest re-run, 2026-08-02 (accepted on 2025-12-11).

Every step, and the latest re-run
StepAccepted on
check 68, 2025-12-11, initial
Latest re-run
check 761, 2026-08-02, drc_update, gf180mcu-precheck 1.7.3
PDK open_pdks 1.0.604, LibreLane 5fe3db1
KLayout.ReadLayout—passed
KLayout.CheckTopLevel—passed
KLayout.CheckSize—passed
KLayout.GenerateID—passed
KLayout.Render—passed
KLayout.Density—passed
Checker.KLayoutDensity—passed
KLayout.ZeroAreaPolygons—passed
Checker.KLayoutZeroAreaPolygons—passed
KLayout.Antenna—passed
Checker.KLayoutAntenna—passed
Magic.DRC—passed
Checker.MagicDRC—passed
KLayout.DRC—passed
Checker.KLayoutDRC—passed
KLayout.WriteLayout—passed
KLayout DRC errors0
Magic DRC errors (advisory)0
FilesThe platform no longer stores this check's results.steps · log (gzip)

The steps of the gf180mcu-precheck LibreLane flow, as run by platform.wafer.space. The design was accepted on the newest finished check before it was submitted; later re-runs check the same file with updated rules. KLayout DRC is the sign-off check. Magic DRC is advisory: its count does not stop a design. In the logs, Magic's "Error while reading cell" lines about fill cells are messages from its reader, not check failures.

Data and method

Everything on this page is measured from the public layout; the dates come from the published schedules.

  • Logic cells are standard cell instances, excluding fillers, taps, antenna diodes and tie cells.
  • Transistors are places where gate polysilicon crosses diffusion, not counting dummy fill.
  • Core area is the whole project.
  • Bond pads are the pad openings in the pad ring, or in a second ring of pads inside it for chip-on-board bonding; probe pads are the others, next to the blocks they test. Letters and logos on the pad layer are not pads.
  • Theoretical maximum tiles one cell at its placement boundary with no routing.
  • Densest 0.1 mm square is the best 0.1 mm square anywhere in each die, sliding in 20 µm steps and avoiding SRAM, given per mm².

What is Tiny Tapeout?

Tiny Tapeout is the quickest and cheapest way to get your own design made on a real chip.

Many designs share one Tiny Tapeout chip. Each project gets one or more small tiles, and a multiplexer on the chip connects the one you choose to the pins. Draw your first design in the browser with no experience by following the digital design guide, or write it in Verilog or another HDL; Tiny Tapeout's templates build and check it on GitHub. The chip comes on a demo board that selects your design and drives it.

Tiny Tapeout also runs workshops and supports teaching in universities and schools. Browse every Tiny Tapeout chip and the projects proven in silicon, or read the Tiny Tapeout FAQ.

The Tiny Tapeout demo board, with the socket in the middle where the chip's breakout card plugs in
Tiny Tapeout chips come on a breakout card that plugs into the middle of the demo board. Its RP2350 selects a project and drives its clock; the DIP switches, the seven-segment display and the Pmod headers connect to the project's pins. Render: Tiny Tapeout, tt-demo-pcb, Apache 2.0.

Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.