Tiny Tapeout GF 0.3 · Die T0P3 on wafer.space Run 2
518 · RISC-V and CPUs · 4 × 4 tiles
by Hirosh Dabui
Rendered from the layout at 0.90 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings
| Core average logic cells per mm² | 19k (25% of buffer maximum) |
|---|---|
| Densest 0.1 mm square logic cells per mm² | 28k (37% of buffer maximum) |
| Core covered by logic | 58% |
| Transistor density transistors per mm² | 296k average, 294k in the 0.1 mm square with the most logic cells |
Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.
A RISC-V ASIC that can boot μLinux.
Source repository Its page on Tiny TapeoutBuy a chip and board
| Size | 1440 × 737 µm (1.061 mm²) |
|---|---|
| Macro | tt_um_kianV_rv32ima_uLinux_SoC |
| Files | documentation · licence · layout and netlist in Tiny Tapeout GF 0.3 |
| Tiles | 4 × 4 at column 0, row 1 of the tile grid |
| Mux address | 518 |
| Language | Verilog |
| Clock | 16 MHz |
| Built with | LibreLane 3.0.0.dev45, open_pdks 8afc8346a57f |
| Transistors | 315,831 |
| Logic cells | 20,266 + 42,242 filler and tap cells |
| Libraries | 7t-5V (20k) |
| SRAM | No SRAM |
Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.
| 5 V | 7t-5V standard cells |
|---|---|
| Gate oxides | Thick only (5 V/6 V) in the design itself |
How this project's area splits between logic cells, filler and tap cells and other.
The ten standard cells this design uses most.
| Cell | Library | Instances | What it does |
|---|---|---|---|
| nor2_1 | 7t-5V | 2,319 | 2-input NOR gate |
| dffq_4 | 7t-5V | 2,146 | D flip-flop (1 bit storage, 4x drive) |
| nand2_1 | 7t-5V | 2,003 | 2-input NAND gate |
| aoi21_1 | 7t-5V | 1,780 | AND-OR-Invert compound gate |
| buf_4 | 7t-5V | 1,271 | Buffer (4x drive) |
| inv_1 | 7t-5V | 1,214 | Inverter |
| oai211_1 | 7t-5V | 1,111 | OR-AND-Invert compound gate |
| buf_2 | 7t-5V | 622 | Buffer (2x drive) |
| aoi22_1 | 7t-5V | 618 | AND-OR-Invert (2x2 inputs) |
| dffq_1 | 7t-5V | 578 | D flip-flop (1 bit storage) |
Logic cells per mm² in each 0.1 mm square of the project (counted in the square, scaled up to a mm²). Hatched outlines are SRAM macros; the red outline is the densest 0.1 mm square that avoids them (28k logic cells per mm²), found by sliding a 0.1 mm square over the project in 20 µm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.
KianV RISC-V Linux SoC has been made on 10 shuttles since Nov 2023. Every version, oldest first, with this one in bold:
Tiny Tapeout tile Google shuttle wafer.space die
KianV RISC-V Linux SoC started as a few tiles on Tiny Tapeout 5 and went on to dies of its own on wafer.space Run 1 and wafer.space Run 2. When your design outgrows its tiles, a whole die on a wafer.space run is the next step.
Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.