Tiny Tapeout GF 0.2 · Die TTPG on wafer.space Run 1: the power-gated edition

Quickscope

196 · Other digital · 1 × 2 tiles

by Frans Skarman

Rendered from the layout at 0.33 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Core average
logic cells per mm²
15k (20% of buffer maximum)
Densest 0.1 mm square
logic cells per mm²
29k (39% of buffer maximum)
Core covered by logic52%
Transistor density
transistors per mm²
276k average, 322k in the 0.1 mm square with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.

A quick logic analyzer

Size347 × 325 µm (0.113 mm²)
Macrott_um_thezoq2_quickscope
Filesdocumentation · licence · layout and netlist in Tiny Tapeout GF 0.2
Tiles1 × 2 at column 6, row 7 of the tile grid
Mux address196
LanguageVerilog
Clock25 MHz
Built withLibreLane 2.4.2, open_pdks 0fe599b2afb6
Transistors31,831
Logic cells1,718 + 3,368 filler and tap cells
Libraries 7t-5V (2k)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this project's area splits between logic cells, filler and tap cells and other.

52%
42%
  • Logic cells 0.06 mm² (52%)
  • Filler and tap cells 0.05 mm² (42%)
  • Other 0.01 mm² (7%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
dffq_17t-5V 367D flip-flop (1 bit storage)
mux2_27t-5V 2162-input multiplexer (2x drive)
nor2_17t-5V 1202-input NOR gate
nand2_17t-5V 1062-input NAND gate
clkbuf_87t-5V 88Clock buffer (8x drive)
clkinv_17t-5V 84Clock inverter
aoi21_17t-5V 78AND-OR-Invert compound gate
buf_27t-5V 52Buffer (2x drive)
oai21_17t-5V 46OR-AND-Invert compound gate
nor3_17t-5V 443-input NOR gate

Logic density map

27 logic cells, 2,205 transistors 191 logic cells, 2,871 transistors 217 logic cells, 2,889 transistors 63 logic cells, 1,205 transistors 55 logic cells, 2,554 transistors 255 logic cells, 3,335 transistors 262 logic cells, 3,200 transistors 63 logic cells, 1,341 transistors 36 logic cells, 2,406 transistors 190 logic cells, 3,152 transistors 199 logic cells, 3,226 transistors 64 logic cells, 1,351 transistors 0 logic cells, 446 transistors 27 logic cells, 624 transistors 53 logic cells, 728 transistors 16 logic cells, 298 transistors Densest SRAM-free 0.1 mm square: 294 logic cells 3k 19k 22k 5k 25k 26k 4k 19k 20k

Logic cells per mm² in each 0.1 mm square of the project (counted in the square, scaled up to a mm²). Hatched outlines are SRAM macros; the red outline is the densest 0.1 mm square that avoids them (29k logic cells per mm²), found by sliding a 0.1 mm square over the project in 20 µm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Want your own design on a chip like this one?

Start with a tile: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3. For a die of your own, wafer.space Run 3 takes orders until 9 December 2026.

Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.