Tiny Tapeout GF 0.2 · Die TTPG on wafer.space Run 1: the power-gated edition

DDR throughput and flop aperture test

613 · Other digital · 1 × 1 tile

by Darryl Miles project from Eric Smith

Rendered from the layout at 0.33 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

90 logic cells: too few for density figures, which are given for projects of 1,000 or more.

Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.

Grab data on every edge of clock with varying pos pulse width

Size347 × 161 µm (0.056 mm²)
Macrott_um_dlmiles_ddr_throughput_test
Filesdocumentation · licence · layout and netlist in Tiny Tapeout GF 0.2
Tiles1 × 1 at column 6, row 19 of the tile grid
Mux address613
LanguageVerilog
Built withLibreLane 2.4.2, open_pdks 0fe599b2afb6
Transistors11,581
Logic cells90 + 1,284 filler and tap cells
Libraries 7t-5V (90)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this project's area splits between logic cells, filler and tap cells and other.

89%
  • Logic cells 2,066 µm² (4%)
  • Filler and tap cells 0.05 mm² (89%)
  • Other 4,033 µm² (7%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
inv_27t-5V 40Inverter (2x drive)
clkinv_17t-5V 16Clock inverter
and2_27t-5V 82-input AND gate (2x drive)
dlyb_17t-5V 5Delay buffer
buf_47t-5V 4Buffer (4x drive)
dffrnq_27t-5V 4D flip-flop with reset (2x drive)
or2_27t-5V 42-input OR gate (2x drive)
clkbuf_167t-5V 3Clock buffer (16x drive)
buf_17t-5V 1Buffer
buf_27t-5V 1Buffer (2x drive)

Want your own design on a chip like this one?

Start with a tile: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3. For a die of your own, wafer.space Run 3 takes orders until 9 December 2026.

Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.