Tiny Tapeout GF 0.2 · Die TTPG on wafer.space Run 1: the power-gated edition

PRISM 8 with TinySnake

579 · Games · 1 × 1 tile

by Ken Pettit

Rendered from the layout at 0.33 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Core average
logic cells per mm²
25k (33% of buffer maximum)
Densest 0.1 mm square
logic cells per mm²
33k (43% of buffer maximum)
Core covered by logic69%
Transistor density
transistors per mm²
286k average, 327k in the 0.1 mm square with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.

PRISM plus Tiny Snake implemented in Wowki

Size347 × 161 µm (0.056 mm²)
Macrott_um_wokwi_442081253563458561
Filesdocumentation · licence · layout and netlist in Tiny Tapeout GF 0.2
Tiles1 × 1 at column 5, row 0 of the tile grid
Mux address579
LanguageWokwi
Clock10 kHz
Built withLibreLane 2.4.2, open_pdks 0fe599b2afb6
Transistors15,989
Logic cells1,401 + 1,766 filler and tap cells
Libraries 7t-5V (1k)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this project's area splits between logic cells, filler and tap cells and other.

69%
24%
  • Logic cells 0.04 mm² (69%)
  • Filler and tap cells 0.01 mm² (24%)
  • Other 4,033 µm² (7%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
clkinv_17t-5V 318Clock inverter
and2_17t-5V 2622-input AND gate
dffq_17t-5V 207D flip-flop (1 bit storage)
or2_17t-5V 1992-input OR gate
mux2_27t-5V 622-input multiplexer (2x drive)
nand2_17t-5V 502-input NAND gate
and2_47t-5V 452-input AND gate (4x drive)
dffrsnq_17t-5V 37D flip-flop with set and reset
buf_27t-5V 30Buffer (2x drive)
xor2_17t-5V 272-input XOR gate

Logic density map

232 logic cells, 2,693 transistors 262 logic cells, 2,919 transistors 289 logic cells, 3,085 transistors 99 logic cells, 1,223 transistors 122 logic cells, 1,585 transistors 158 logic cells, 1,840 transistors 170 logic cells, 1,884 transistors 69 logic cells, 760 transistors Densest SRAM-free 0.1 mm square: 329 logic cells 23k 26k 29k 12k 16k 17k

Logic cells per mm² in each 0.1 mm square of the project (counted in the square, scaled up to a mm²). Hatched outlines are SRAM macros; the red outline is the densest 0.1 mm square that avoids them (33k logic cells per mm²), found by sliding a 0.1 mm square over the project in 20 µm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Want your own design on a chip like this one?

Start with a tile: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3. For a die of your own, wafer.space Run 3 takes orders until 9 December 2026.

Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.