QZ80 · Retro computing · ½ × ½ slot
Rendered from the layout at 2.5 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings
| Inside the core logic cells per mm² | 3k
(5% of buffer maximum) over the 1.73 mm² core: what the design itself packed |
|---|---|
| Inside the seal ring logic cells per mm² | 1k
over all 4.68 mm² of the slot, pad ring included |
| Densest mm² logic cells per mm² | 4k (7% of buffer maximum) |
| Core covered by logic | 10% |
| Transistor density transistors per mm² | 196k average, 185k in the mm² with the most logic cells |
Every figure here is measured from the public layout, the same way for every design on the run: see data and method, and how its designs used the process.
Silicon proven, pin compatible, open-source replacement for Zilog Z80 a classic 8-bit CPU.
| Die | 1.94 × 2.53 mm (4.9 mm²) |
|---|---|
| Core area | 1.73 mm² inside the pad ring
as set in the design's own layout settings |
| Inside the seal ring | 4.68 mm² (the die less its 26 µm seal ring) |
| Placements | 1 on the reticle, in slot H2 |
| Bond pads | 56 |
| Transistors | 339,056 |
| Logic cells | 5,096 + 36,102 filler and tap cells |
| Libraries | 9t-5V (5k) |
| SRAM | No SRAM |
| Licence | Apache-2.0 declared
Repository: Apache-2.0 in LICENSE — agrees |
|---|---|
| Template | wafer-space/gf180mcu-project-template 1.3.5 |
| How it was checked | Commit and PDK pinThe licence and template were read from the repository at commit 56308db64709.The template release named above is the one whose Makefile pins the same PDK as that commit (PDK_TAG 1.6.6). |
| Chip-on-board | Not selected at submission |
| Precheck | Passed
the check it was accepted on, 2026-07-16, gf180mcu-precheck 1.7.2
Passed latest re-run, 2026-08-03, gf180mcu-precheck 1.7.3 step results and logs |
Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.
| 5 V | 9t-5V standard cells |
|---|---|
| Gate oxides | Thick only (5 V/6 V) in the design itself |
| I/O library | gf180mcu_fd_io (416 cells), gf180mcu_ws_io (8 cells) |
How this design's area splits between logic cells, filler and tap cells, other and pad ring.
The ten standard cells this design uses most.
| Cell | Library | Instances | What it does |
|---|---|---|---|
| nand2_1 | 9t-5V | 703 | 2-input NAND gate |
| nor2_1 | 9t-5V | 348 | 2-input NOR gate |
| mux2_1 | 9t-5V | 309 | 2-input multiplexer |
| dlyd_1 | 9t-5V | 293 | Delay buffer |
| dlyc_1 | 9t-5V | 265 | Delay buffer |
| aoi21_1 | 9t-5V | 257 | AND-OR-Invert compound gate |
| oai21_1 | 9t-5V | 239 | OR-AND-Invert compound gate |
| clkinv_1 | 9t-5V | 175 | Clock inverter |
| dffq_1 | 9t-5V | 170 | D flip-flop (1 bit storage) |
| nand3_1 | 9t-5V | 166 | 3-input NAND gate |
Logic cells per mm² in each square millimetre of the die. Hatched outlines are SRAM macros; the red outline is the densest mm² that avoids them (4k logic cells per mm²), found by sliding a 1 mm square over the die in 0.1 mm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.
Open-source Z80 has been made on 7 shuttles since Jun 2024. Every version, oldest first, with this one in bold:
Tiny Tapeout tile Google shuttle wafer.space die
Every die of this design measured here, oldest first, with this one in bold.
| Made on | Slot | Library | Gate oxides | Logic cells | Per mm² of core | Densest | SRAM |
|---|---|---|---|---|---|---|---|
| wafer.space Run 1 · HZ80 | ½ × 1 | 9t-5V | 5 V/6 V only | 5,143 | 1k | 5k | none |
| wafer.space Run 1 · RZ80 | 1 × 1 | 9t-5V | 5 V/6 V only | 5,209 | <1k | 5k | none |
| wafer.space Run 2 · HZ80 the same logic cells and transistors as HZ80 on wafer.space Run 1 |
½ × 1 | 9t-5V | 5 V/6 V only | 5,143 | 1k | 5k | none |
| wafer.space Run 2 · QZ80 | ½ × ½ | 9t-5V | 5 V/6 V only | 5,096 | 3k | 4k | none |
Open-source Z80 began as tiles on Tiny Tapeout 7, and now has dies of its own on wafer.space Run 1 and wafer.space Run 2.
Before a design is made, the wafer.space platform checks it against the foundry's design rules. QZ80 was accepted on this check, and has been checked again since with newer rules.
All 16 steps passed, with 0 KLayout DRC errors, on 2026-07-16.
| Step | Accepted on check 696, 2026-07-16, duplicated, gf180mcu-precheck 1.7.2 PDK open_pdks 1.0.604, LibreLane 5fe3db1 | Latest re-run check 799, 2026-08-03, drc_update, gf180mcu-precheck 1.7.3 PDK open_pdks 1.0.604, LibreLane 5fe3db1 |
|---|---|---|
| KLayout.ReadLayout | passed | passed |
| KLayout.CheckTopLevel | passed | passed |
| KLayout.CheckSize | passed | passed |
| KLayout.GenerateID | passed | passed |
| KLayout.Render | passed | passed |
| KLayout.Density | passed | passed |
| Checker.KLayoutDensity | passed | passed |
| KLayout.ZeroAreaPolygons | passed | passed |
| Checker.KLayoutZeroAreaPolygons | passed | passed |
| KLayout.Antenna | passed | passed |
| Checker.KLayoutAntenna | passed | passed |
| Magic.DRC | passed | passed |
| Checker.MagicDRC | passed | passed |
| KLayout.DRC | passed | passed |
| Checker.KLayoutDRC | passed | passed |
| KLayout.WriteLayout | passed | passed |
| KLayout DRC errors | 0 | 0 |
| Magic DRC errors (advisory) | 0 | 0 |
| Files | steps · log (gzip) | steps · log (gzip) |
The steps of the gf180mcu-precheck LibreLane flow, as run by platform.wafer.space. The design was accepted on the newest finished check before it was submitted; later re-runs check the same file with updated rules. KLayout DRC is the sign-off check. Magic DRC is advisory: its count does not stop a design. In the logs, Magic's "Error while reading cell" lines about fill cells are messages from its reader, not check failures.