wafer.space Run 1

FOSSi open-source replacement for Z80 classic 8-bit CPU

RZ80 · Retro computing · 1 × 1 slot

Rendered from the layout at 2.5 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Inside the core
logic cells per mm²
<1k (1% of buffer maximum)
over the 12.92 mm² core: what the design itself packed
Inside the seal ring
logic cells per mm²
<1k
over all 19.65 mm² of the slot, pad ring included
Densest mm²
logic cells per mm²
5k (8% of buffer maximum)
Core covered by logic1%
Transistor density
transistors per mm²
177k average, 189k in the mm² with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the run: see data and method, and how its designs used the process.

Silicon proven, pin compatible, open-source replacement for Zilog Z80 a classic 8-bit CPU.

https://github.com/rejunity/z80-open-silicon

Die3.93 × 5.12 mm (20.1 mm²)
Core area12.92 mm² inside the pad ring
as set in the design's own layout settings
Inside the seal ring19.65 mm² (the die less its 26 µm seal ring)
Placements2 on the reticle, in slots A4, B4 RZ80 on the reticle
Bond pads74
Transistors2,292,402
Logic cells5,209 + 208,620 filler and tap cells
Libraries 9t-5V (5k)
SRAMNo SRAM

Submission

LicenceApache-2.0 declared
Repository: Apache-2.0 in LICENSE — agrees
Templatewafer-space/gf180mcu-project-template 1.3.5
How it was checked
Commit and PDK pin The licence and template were read from the repository at commit 56308db64709.The template release named above is the one whose Makefile pins the same PDK as that commit (PDK_TAG 1.6.6).
Chip-on-boardNot selected at submission
PrecheckPassed the check it was accepted on, 2025-12-20, gf180mcu-precheck 1.5.5 (from its image)
Passed latest re-run, 2026-08-02, gf180mcu-precheck 1.7.3
step results and logs

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V9t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself
I/O librarygf180mcu_fd_io (1122 cells), gf180mcu_ws_io (18 cells)

Where the area went

How this design's area splits between logic cells, filler and tap cells, other and pad ring.

63%
36%
  • Logic cells 0.19 mm² (1%)
  • Filler and tap cells 12.71 mm² (63%)
  • Other 0.02 mm² (<1%)
  • Pad ring 7.20 mm² (36%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
nand2_19t-5V 6992-input NAND gate
nor2_19t-5V 3472-input NOR gate
mux2_19t-5V 3092-input multiplexer
dlyd_19t-5V 288Delay buffer
aoi21_19t-5V 259AND-OR-Invert compound gate
dlyc_19t-5V 257Delay buffer
oai21_19t-5V 236OR-AND-Invert compound gate
clkinv_19t-5V 171Clock inverter
dffq_19t-5V 170D flip-flop (1 bit storage)
nand3_19t-5V 1643-input NAND gate

Logic density map

8 logic cells, 57,781 transistors 32 logic cells, 99,681 transistors 8 logic cells, 99,643 transistors 1 logic cells, 51,098 transistors 16 logic cells, 99,245 transistors 17 logic cells, 172,450 transistors 13 logic cells, 172,476 transistors 4 logic cells, 87,648 transistors 408 logic cells, 100,019 transistors 3,435 logic cells, 184,030 transistors 10 logic cells, 171,970 transistors 2 logic cells, 87,075 transistors 61 logic cells, 99,583 transistors 1,118 logic cells, 176,970 transistors 15 logic cells, 172,454 transistors 15 logic cells, 87,597 transistors 11 logic cells, 69,876 transistors 11 logic cells, 120,155 transistors 17 logic cells, 120,382 transistors 7 logic cells, 61,423 transistors 0 logic cells, 176 transistors 0 logic cells, 256 transistors 0 logic cells, 255 transistors 0 logic cells, 159 transistors Densest SRAM-free mm²: 4,684 logic cells <1k <1k <1k <1k <1k <1k <1k <1k <1k 3k <1k <1k <1k 1k <1k <1k <1k <1k <1k <1k

Logic cells per mm² in each square millimetre of the die. Hatched outlines are SRAM macros; the red outline is the densest mm² that avoids them (5k logic cells per mm²), found by sliding a 1 mm square over the die in 0.1 mm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Open-source Z80 has been made on 7 shuttles since Jun 2024. Every version, oldest first, with this one in bold:

  1. Jun 2024 · Tiny Tapeout 7 Zilog Z80 — 2 × 2 tiles
  2. Nov 2024 · Tiny Tapeout IHP 0.2 Zilog Z80 — 2 × 2 tiles
  3. Nov 2024 · Tiny Tapeout 9 Zilog Z80 — 2 × 2 tiles
  4. Mar 2025 · Tiny Tapeout IHP 25a Zilog Z80 — 2 × 2 tiles
  5. Nov 2025 · Tiny Tapeout GF 0.2 Zilog Z80 — 2 × 2 tiles
  6. Dec 2025 · wafer.space Run 1 RZ80 FOSSi open-source replacement for Z80 classic 8-bit CPU — 1 × 1 slot HZ80 FOSSi open-source replacement for Z80 classic 8-bit CPU (0.5 x 1 slot) — ½ × 1 slot
  7. Jul 2026 · wafer.space Run 2 HZ80 FOSSi open-source replacement for Z80 classic 8-bit CPU (0.5 x 1 slot) — ½ × 1 slot QZ80 FOSSi open-source replacement for Z80 classic 8-bit CPU (0.5 x 0.5 slot) — ½ × ½ slot

Tiny Tapeout tile Google shuttle wafer.space die

Its dies compared

Every die of this design measured here, oldest first, with this one in bold.

Made onSlotLibraryGate oxides Logic cellsPer mm² of coreDensest SRAM
wafer.space Run 1 · HZ80 ½ × 19t-5V 5 V/6 V only 5,143 1k 5k none
wafer.space Run 1 · RZ80 1 × 19t-5V 5 V/6 V only 5,209 <1k 5k none
wafer.space Run 2 · HZ80
the same logic cells and transistors as HZ80 on wafer.space Run 1
½ × 19t-5V 5 V/6 V only 5,143 1k 5k none
wafer.space Run 2 · QZ80 ½ × ½9t-5V 5 V/6 V only 5,096 3k 4k none

From Tiny Tapeout tiles to a die of its own

Open-source Z80 began as tiles on Tiny Tapeout 7, and now has dies of its own on wafer.space Run 1 and wafer.space Run 2.

The fabricated die

A photograph of the finished chip, taken through a microscope after manufacture: optical micrograph © 2026 InfoSecDJ, CC BY-SA 4.0

Precheck

Before a design is made, the wafer.space platform checks it against the foundry's design rules. RZ80 was accepted on this check, and has been checked again since with newer rules.

All 15 steps passed, with 0 KLayout DRC errors, on 2025-12-20.

Every step, and the latest re-run
StepAccepted on
check 204, 2025-12-20, initial, gf180mcu-precheck 1.5.5 (from its image)
PDK wafer-space/gf180mcu 1.6.6, LibreLane e2f0b0e
Latest re-run
check 714, 2026-08-02, drc_update, gf180mcu-precheck 1.7.3
PDK open_pdks 1.0.604, LibreLane 5fe3db1
KLayout.ReadLayoutpassedpassed
KLayout.CheckTopLevelpassedpassed
KLayout.CheckSizepassedpassed
KLayout.GenerateIDpassedpassed
KLayout.Rendernot in this flowpassed
KLayout.Densitypassedpassed
Checker.KLayoutDensitypassedpassed
KLayout.ZeroAreaPolygonspassedpassed
Checker.KLayoutZeroAreaPolygonspassedpassed
KLayout.Antennapassedpassed
Checker.KLayoutAntennapassedpassed
Magic.DRCpassedpassed
Checker.MagicDRCpassedpassed
KLayout.DRCpassedpassed
Checker.KLayoutDRCpassedpassed
KLayout.WriteLayoutpassedpassed
KLayout DRC errors00
Magic DRC errors (advisory)00
Filessteps · log (gzip)steps · log (gzip)

The steps of the gf180mcu-precheck LibreLane flow, as run by platform.wafer.space. The design was accepted on the newest finished check before it was submitted; later re-runs check the same file with updated rules. KLayout DRC is the sign-off check. Magic DRC is advisory: its count does not stop a design. In the logs, Magic's "Error while reading cell" lines about fill cells are messages from its reader, not check failures.

Want a chip of your own like this one?

wafer.space Run 3 takes orders until 9 December 2026. Or start smaller with Tiny Tapeout: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3.