wafer.space Run 2

RLCM: Test Passives For GF180MCUD

RLCM · Test structures · ½ × 1 slot

Rendered from the layout at 2.5 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Every figure here is measured from the public layout, the same way for every design on the run: see data and method, and how its designs used the process.

This TO aims to have a kind of test passives to verify the automated openEMS flow used to simulate passives on GF180MCUD.

Die1.94 × 5.12 mm (9.9 mm²)
Core area4.47 mm² inside the pad ring
the project template's, 442 µm in from each edge
Inside the seal ring9.57 mm² (the die less its 26 µm seal ring)
Placements1 on the reticle, in slot H4 RLCM on the reticle
Bond pads246
Transistors0
Logic cells0
SRAMNo SRAM

Submission

LicenceCERN-OHL-P-2.0 declared
The repository has no licence file
How it was checked
Commit and PDK pin The licence and template were read from the repository at commit d1bc20b4f854.
Chip-on-boardSelected at submission
PrecheckPassed the check it was accepted on, 2026-07-15, gf180mcu-precheck 1.7.2 (from its image)
Passed latest re-run, 2026-08-03, gf180mcu-precheck 1.7.3
step results and logs

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

MIM capacitors2 (11,350 µm², between Metal4 and Metal5)

Where the area went

How this design's area splits between other and pad ring.

45%
55%
  • Other 4.47 mm² (45%)
  • Pad ring 5.46 mm² (55%)

Precheck

Before a design is made, the wafer.space platform checks it against the foundry's design rules. RLCM was accepted on this check, and has been checked again since with newer rules.

All 17 steps passed, with 0 KLayout DRC errors, on 2026-07-15.

Every step, and the latest re-run
StepAccepted on
check 658, 2026-07-15, initial, gf180mcu-precheck 1.7.2 (from its image)
PDK open_pdks 1.0.604, LibreLane 5fe3db1
Latest re-run
check 773, 2026-08-03, drc_update, gf180mcu-precheck 1.7.3
PDK open_pdks 1.0.604, LibreLane 5fe3db1
KLayout.ReadLayoutpassedpassed
KLayout.CheckTopLevelpassedpassed
KLayout.CheckSizepassedpassed
KLayout.CheckPadMaskpassedpassed
KLayout.GenerateIDpassedpassed
KLayout.Renderpassedpassed
KLayout.Densitypassedpassed
Checker.KLayoutDensitypassedpassed
KLayout.ZeroAreaPolygonspassedpassed
Checker.KLayoutZeroAreaPolygonspassedpassed
KLayout.Antennapassedpassed
Checker.KLayoutAntennapassedpassed
Magic.DRCpassedpassed
Checker.MagicDRCadvisory warningadvisory warning
KLayout.DRCpassedpassed
Checker.KLayoutDRCpassedpassed
KLayout.WriteLayoutpassedpassed
KLayout DRC errors00
Magic DRC errors (advisory)618618
Filessteps · log (gzip)steps · log (gzip)

The steps of the gf180mcu-precheck LibreLane flow, as run by platform.wafer.space. The design was accepted on the newest finished check before it was submitted; later re-runs check the same file with updated rules. KLayout DRC is the sign-off check. Magic DRC is advisory: its count does not stop a design. In the logs, Magic's "Error while reading cell" lines about fill cells are messages from its reader, not check failures.

Want a chip of your own like this one?

wafer.space Run 3 takes orders until 9 December 2026. Or start smaller with Tiny Tapeout: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3.