wafer.space Run 2

Artwork Meme Chip

MEME · Art and logos · 1 × ½ slot

Rendered from the layout at 2.5 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

226 logic cells: too few for density figures, which are given for designs of 1,000 or more.

Every figure here is measured from the public layout, the same way for every design on the run: see data and method, and how its designs used the process.

Meme chip for marketing and swag

Die3.93 × 2.53 mm (9.9 mm²)
Core area5.01 mm² inside the pad ring
the project template's, 442 µm in from each edge
Inside the seal ring9.61 mm² (the die less its 26 µm seal ring)
Placements2 on the reticle, in slots E2, F2 MEME on the reticle
Bond pads72
Transistors170,882
Logic cells226 + 15,682 filler and tap cells
Libraries 7t-5V (226)
SRAMNo SRAM

Submission

LicenceMIT declared
Repository: MIT in LICENSE — agrees
Templateegorxe/gf180mcu-caravel-template
from its README
How it was checked
Commit and PDK pin The licence and template were read from the repository at commit c11dda5b87b4.
Chip-on-boardNot selected at submission
PrecheckPassed the check it was accepted on, 2026-07-14, gf180mcu-precheck 1.7.2 (from its image)
Passed latest re-run, 2026-08-02, gf180mcu-precheck 1.7.3
step results and logs

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself
Unsalicided poly resistors192 (1,260 µm²)
I/O librarygf180mcu_fd_io (758 cells)

Where the area went

How this design's area splits between filler and tap cells, other and pad ring.

44%
50%
  • Filler and tap cells 0.68 mm² (7%)
  • Other 4.33 mm² (44%)
  • Pad ring 4.93 mm² (50%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
buf_17t-5V 89Buffer
dffq_17t-5V 26D flip-flop (1 bit storage)
aoi21_17t-5V 14AND-OR-Invert compound gate
nor2_17t-5V 112-input NOR gate
oai21_17t-5V 10OR-AND-Invert compound gate
clkbuf_17t-5V 9Clock buffer
clkinv_17t-5V 8Clock inverter
nor3_17t-5V 83-input NOR gate
buf_27t-5V 7Buffer (2x drive)
clkbuf_27t-5V 7Clock buffer (2x drive)

Precheck

Before a design is made, the wafer.space platform checks it against the foundry's design rules. MEME was accepted on this check, and has been checked again since with newer rules.

All 16 steps passed, with 0 KLayout DRC errors, on 2026-07-14.

Every step, and the latest re-run
StepAccepted on
check 516, 2026-07-14, initial, gf180mcu-precheck 1.7.2 (from its image)
PDK open_pdks 1.0.604, LibreLane 5fe3db1
Latest re-run
check 712, 2026-08-02, drc_update, gf180mcu-precheck 1.7.3
PDK open_pdks 1.0.604, LibreLane 5fe3db1
KLayout.ReadLayoutpassedpassed
KLayout.CheckTopLevelpassedpassed
KLayout.CheckSizepassedpassed
KLayout.GenerateIDpassedpassed
KLayout.Renderpassedpassed
KLayout.Densitypassedpassed
Checker.KLayoutDensitypassedpassed
KLayout.ZeroAreaPolygonspassedpassed
Checker.KLayoutZeroAreaPolygonspassedpassed
KLayout.Antennapassedpassed
Checker.KLayoutAntennapassedpassed
Magic.DRCpassedpassed
Checker.MagicDRCpassedpassed
KLayout.DRCpassedpassed
Checker.KLayoutDRCpassedpassed
KLayout.WriteLayoutpassedpassed
KLayout DRC errors00
Magic DRC errors (advisory)00
Filessteps · log (gzip)steps · log (gzip)

The steps of the gf180mcu-precheck LibreLane flow, as run by platform.wafer.space. The design was accepted on the newest finished check before it was submitted; later re-runs check the same file with updated rules. KLayout DRC is the sign-off check. Magic DRC is advisory: its count does not stop a design. In the logs, Magic's "Error while reading cell" lines about fill cells are messages from its reader, not check failures.

Want a chip of your own like this one?

wafer.space Run 3 takes orders until 9 December 2026. Or start smaller with Tiny Tapeout: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3.