wafer.space Run 2

EuroSynth

EURO · Analog and mixed-signal · 1 × ½ slot

Rendered from the layout at 2.5 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Inside the core
logic cells per mm²
14k (18% of buffer maximum)
over the 5.02 mm² core: what the design itself packed
Inside the seal ring
logic cells per mm²
7k
over all 9.61 mm² of the slot, pad ring included
Densest mm²
logic cells per mm²
27k (36% of buffer maximum)
Core covered by logic34%
Transistor density
transistors per mm²
211k average, 310k in the mm² with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the run: see data and method, and how its designs used the process.

A kitchen-sink synthesizer voice in custom silicon — a fully digital eurorack synth voice taped out on the open-source GlobalFoundries 180 nm (GF180MCU) PDK with the LibreLane RTL-to-GDSII flow.

Die3.93 × 2.53 mm (9.9 mm²)
Core area5.02 mm² inside the pad ring
as set in the design's own layout settings
Inside the seal ring9.61 mm² (the die less its 26 µm seal ring)
Placements1 on the reticle, in slot B2 EURO on the reticle
Bond pads72
Transistors1,057,096
Logic cells68,077 + 129,324 filler and tap cells
Libraries 7t-5V (68k)
SRAMNo SRAM

Submission

LicenceApache-2.0 declared
Repository: Apache-2.0 in LICENSE — agrees
Templateegorxe/gf180mcu-caravel-template
from its README
How it was checked
Commit and PDK pin The licence and template were read from the repository at commit 606cb4d8cd1e.
Chip-on-boardSelected at submission
PrecheckPassed the check it was accepted on, 2026-07-06
Passed latest re-run, 2026-08-02, gf180mcu-precheck 1.7.3
step results and logs

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself
I/O librarygf180mcu_fd_io (758 cells)

Where the area went

How this design's area splits between logic cells, filler and tap cells, other and pad ring.

17%
21%
13%
50%
  • Logic cells 1.69 mm² (17%)
  • Filler and tap cells 2.06 mm² (21%)
  • Other 1.27 mm² (13%)
  • Pad ring 4.92 mm² (50%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
nand2_17t-5V 12,0112-input NAND gate
buf_17t-5V 6,804Buffer
oai21_17t-5V 6,205OR-AND-Invert compound gate
dffq_17t-5V 6,176D flip-flop (1 bit storage)
xor2_17t-5V 3,5952-input XOR gate
aoi21_17t-5V 3,177AND-OR-Invert compound gate
buf_47t-5V 2,760Buffer (4x drive)
buf_27t-5V 2,384Buffer (2x drive)
nor2_17t-5V 2,1822-input NOR gate
clkbuf_87t-5V 1,987Clock buffer (8x drive)

Logic density map

6,311 logic cells, 89,282 transistors 12,836 logic cells, 152,175 transistors 14,029 logic cells, 156,344 transistors 3,666 logic cells, 70,931 transistors 7,909 logic cells, 117,200 transistors 14,669 logic cells, 184,796 transistors 7,480 logic cells, 166,418 transistors 1,157 logic cells, 82,912 transistors 0 logic cells, 6,256 transistors 2 logic cells, 8,169 transistors 12 logic cells, 13,391 transistors 6 logic cells, 9,222 transistors Densest SRAM-free mm²: 27,030 logic cells 6k 13k 14k 4k 8k 15k 7k 1k

Logic cells per mm² in each square millimetre of the die. Hatched outlines are SRAM macros; the red outline is the densest mm² that avoids them (27k logic cells per mm²), found by sliding a 1 mm square over the die in 0.1 mm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Precheck

Before a design is made, the wafer.space platform checks it against the foundry's design rules. EURO was accepted on this check, and has been checked again since with newer rules.

All 17 steps passed, with 0 KLayout DRC errors, on 2026-07-06.

Every step, and the latest re-run
StepAccepted on
check 387, 2026-07-06, drc_update
Latest re-run
check 748, 2026-08-02, retry, gf180mcu-precheck 1.7.3
PDK open_pdks 1.0.604, LibreLane 5fe3db1
KLayout.ReadLayoutpassedpassed
KLayout.CheckTopLevelpassedpassed
KLayout.CheckSizepassedpassed
KLayout.CheckPadMaskpassedpassed
KLayout.GenerateIDpassedpassed
KLayout.Renderpassedpassed
KLayout.Densitypassedpassed
Checker.KLayoutDensitypassedpassed
KLayout.ZeroAreaPolygonspassedpassed
Checker.KLayoutZeroAreaPolygonspassedpassed
KLayout.Antennapassedpassed
Checker.KLayoutAntennapassedpassed
Magic.DRCpassedpassed
Checker.MagicDRCpassedpassed
KLayout.DRCpassedpassed
Checker.KLayoutDRCpassedpassed
KLayout.WriteLayoutpassedpassed
KLayout DRC errors00
Magic DRC errors (advisory)00
Filessteps · log (gzip)steps · log (gzip)

The steps of the gf180mcu-precheck LibreLane flow, as run by platform.wafer.space. The design was accepted on the newest finished check before it was submitted; later re-runs check the same file with updated rules. KLayout DRC is the sign-off check. Magic DRC is advisory: its count does not stop a design. In the logs, Magic's "Error while reading cell" lines about fill cells are messages from its reader, not check failures.

Want a chip of your own like this one?

wafer.space Run 3 takes orders until 9 December 2026. Or start smaller with Tiny Tapeout: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3.