wafer.space Run 2

cordic-romless-x8

DPK2 · Accelerators · ½ × ½ slot

Rendered from the layout at 2.5 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Inside the core
logic cells per mm²
19k (25% of buffer maximum)
over the 1.73 mm² core: what the design itself packed
Inside the seal ring
logic cells per mm²
7k
over all 4.68 mm² of the slot, pad ring included
Densest mm²
logic cells per mm²
21k (28% of buffer maximum)
Core covered by logic40%
Transistor density
transistors per mm²
275k average, 267k in the mm² with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the run: see data and method, and how its designs used the process.

8 ROM-less CORDIC engines , each with its owe SPI-slave interface. Each core implements a CORDIC which work on a 16-bit signed fixed-point input Q3.16 (1 sign bit, 3 integer bits, and 12 fraction bits). This engine utilizes SPI-slave interface to receive four 16-bit signed fixed-point inputs (atan₀, alpha, x, y) and returns three 16-bit signed fixed-point outputs (alpha, cosθ, sinθ). With the arctan micro-rotation angles generated on the fly by Taylor-series approximation , no coefficient ROM required.

AFASIK : Its the only ROM-Less Implementation for CORDIC Algorithm

Die1.94 × 2.53 mm (4.9 mm²)
Core area1.73 mm² inside the pad ring
as set in the design's own layout settings
Inside the seal ring4.68 mm² (the die less its 26 µm seal ring)
Placements1 on the reticle, in slot G2 DPK2 on the reticle
Bond pads56
Transistors476,941
Logic cells33,464 + 73,753 filler and tap cells
Libraries 7t-5V (33k)
SRAMNo SRAM

Submission

LicenceApache-2.0 declared
Repository: Apache-2.0 in LICENSE — agrees
Templatewafer-space/gf180mcu-project-template 1.5.7
How it was checked
Commit and PDK pin The licence and template were read from the repository at commit b1fa2b41a1e1.The template release named above is the one whose Makefile pins the same PDK as that commit (PDK_COMMIT d658698bd8bc).
Chip-on-boardSelected at submission
PrecheckPassed the check it was accepted on, 2026-07-15, gf180mcu-precheck 1.7.2 (from its image)
Passed latest re-run, 2026-08-02, gf180mcu-precheck 1.7.3
step results and logs

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself
I/O librarygf180mcu_fd_io (424 cells)

Where the area went

How this design's area splits between logic cells, filler and tap cells, other and pad ring.

14%
21%
65%
  • Logic cells 0.70 mm² (14%)
  • Filler and tap cells 1.02 mm² (21%)
  • Other 0.01 mm² (<1%)
  • Pad ring 3.18 mm² (65%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
nand2_17t-5V 8,9652-input NAND gate
clkinv_17t-5V 3,906Clock inverter
nand3_17t-5V 3,1963-input NAND gate
dffq_17t-5V 3,118D flip-flop (1 bit storage)
aoi21_17t-5V 2,806AND-OR-Invert compound gate
oai21_17t-5V 2,283OR-AND-Invert compound gate
nor2_17t-5V 1,5682-input NOR gate
buf_17t-5V 940Buffer
aoi211_17t-5V 769AND-OR-Invert compound gate
dlyb_17t-5V 599Delay buffer

Logic density map

5,908 logic cells, 86,145 transistors 4,894 logic cells, 75,956 transistors 11,618 logic cells, 152,131 transistors 9,984 logic cells, 135,248 transistors 482 logic cells, 13,753 transistors 578 logic cells, 13,708 transistors Densest SRAM-free mm²: 21,060 logic cells 6k 5k 12k 10k

Logic cells per mm² in each square millimetre of the die. Hatched outlines are SRAM macros; the red outline is the densest mm² that avoids them (21k logic cells per mm²), found by sliding a 1 mm square over the die in 0.1 mm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Precheck

Before a design is made, the wafer.space platform checks it against the foundry's design rules. DPK2 was accepted on this check, and has been checked again since with newer rules.

All 17 steps passed, with 0 KLayout DRC errors, on 2026-07-15.

Every step, and the latest re-run
StepAccepted on
check 574, 2026-07-15, initial, gf180mcu-precheck 1.7.2 (from its image)
PDK open_pdks 1.0.604, LibreLane 5fe3db1
Latest re-run
check 752, 2026-08-02, drc_update, gf180mcu-precheck 1.7.3
PDK open_pdks 1.0.604, LibreLane 5fe3db1
KLayout.ReadLayoutpassedpassed
KLayout.CheckTopLevelpassedpassed
KLayout.CheckSizepassedpassed
KLayout.CheckPadMaskpassedpassed
KLayout.GenerateIDpassedpassed
KLayout.Renderpassedpassed
KLayout.Densitypassedpassed
Checker.KLayoutDensitypassedpassed
KLayout.ZeroAreaPolygonspassedpassed
Checker.KLayoutZeroAreaPolygonspassedpassed
KLayout.Antennapassedpassed
Checker.KLayoutAntennapassedpassed
Magic.DRCpassedpassed
Checker.MagicDRCpassedpassed
KLayout.DRCpassedpassed
Checker.KLayoutDRCpassedpassed
KLayout.WriteLayoutpassedpassed
KLayout DRC errors00
Magic DRC errors (advisory)00
Filessteps · log (gzip)steps · log (gzip)

The steps of the gf180mcu-precheck LibreLane flow, as run by platform.wafer.space. The design was accepted on the newest finished check before it was submitted; later re-runs check the same file with updated rules. KLayout DRC is the sign-off check. Magic DRC is advisory: its count does not stop a design. In the logs, Magic's "Error while reading cell" lines about fill cells are messages from its reader, not check failures.

Want a chip of your own like this one?

wafer.space Run 3 takes orders until 9 December 2026. Or start smaller with Tiny Tapeout: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3.