wafer.space Run 2

Standard Cell DCO+TDC

DCO0 · Analog and mixed-signal · 1 × ½ slot

Rendered from the layout at 2.5 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Inside the core
logic cells per mm²
1k (2% of buffer maximum)
over the 5.02 mm² core: what the design itself packed
Inside the seal ring
logic cells per mm²
1k
over all 9.61 mm² of the slot, pad ring included
Densest mm²
logic cells per mm²
5k (7% of buffer maximum)
Core covered by logic6%
Transistor density
transistors per mm²
234k average, 150k in the mm² with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the run: see data and method, and how its designs used the process.

A tiny Digital Controlled Oscillator + Time-to-Digital Converter comprised entirely in gf180 standard cells

Die3.93 × 2.53 mm (9.9 mm²)
Core area5.02 mm² inside the pad ring
as set in the design's own layout settings
Inside the seal ring9.61 mm² (the die less its 26 µm seal ring)
Placements1 on the reticle, in slot A2 DCO0 on the reticle
Bond pads72
Transistors1,172,973
Logic cells7,139 + 100,281 filler and tap cells
Libraries 7t-5V (7k)
SRAMNo SRAM

Submission

LicenceApache-2.0 declared
Repository: Apache-2.0 in LICENSE — agrees
Templatewafer-space/gf180mcu-project-template 1.5.3
How it was checked
Commit and PDK pin The licence and template were read from the repository at commit c5b10fc855d7.The template release named above is the one whose Makefile pins the same PDK as that commit (PDK_COMMIT 019cf7a3e0de).
Chip-on-boardSelected at submission
PrecheckPassed the check it was accepted on, 2026-07-14, gf180mcu-precheck 1.7.1 (from its image)
Passed latest re-run, 2026-08-03, gf180mcu-precheck 1.7.3
step results and logs

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself
I/O librarygf180mcu_fd_io (758 cells)

Where the area went

How this design's area splits between logic cells, filler and tap cells, other and pad ring.

48%
50%
  • Logic cells 0.28 mm² (3%)
  • Filler and tap cells 4.73 mm² (48%)
  • Other 0.01 mm² (<1%)
  • Pad ring 4.92 mm² (50%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
dlyb_17t-5V 5,550Delay buffer
dffrnq_17t-5V 518D flip-flop with reset
dlyd_47t-5V 304Delay buffer (4x drive)
mux2_17t-5V 2482-input multiplexer
inv_17t-5V 198Inverter
inv_47t-5V 192Inverter (4x drive)
mux2_27t-5V 322-input multiplexer (2x drive)
invz_17t-5V 16Tri-state inverter
clkbuf_87t-5V 13Clock buffer (8x drive)
buf_47t-5V 8Buffer (4x drive)

Logic density map

611 logic cells, 75,623 transistors 5,147 logic cells, 149,885 transistors 1,380 logic cells, 133,596 transistors 0 logic cells, 64,250 transistors 1 logic cells, 125,631 transistors 0 logic cells, 221,340 transistors 0 logic cells, 221,340 transistors 0 logic cells, 111,564 transistors 0 logic cells, 13,414 transistors 0 logic cells, 22,193 transistors 0 logic cells, 22,225 transistors 0 logic cells, 11,912 transistors Densest SRAM-free mm²: 5,147 logic cells 1k 5k 1k 0 <1k 0 0 0

Logic cells per mm² in each square millimetre of the die. Hatched outlines are SRAM macros; the red outline is the densest mm² that avoids them (5k logic cells per mm²), found by sliding a 1 mm square over the die in 0.1 mm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Precheck

Before a design is made, the wafer.space platform checks it against the foundry's design rules. DCO0 was accepted on this check, and has been checked again since with newer rules.

All 17 steps passed, with 0 KLayout DRC errors, on 2026-07-14.

Every step, and the latest re-run
StepAccepted on
check 489, 2026-07-14, initial, gf180mcu-precheck 1.7.1 (from its image)
PDK open_pdks 1.0.604, LibreLane 5fe3db1
Latest re-run
check 790, 2026-08-03, drc_update, gf180mcu-precheck 1.7.3
PDK open_pdks 1.0.604, LibreLane 5fe3db1
KLayout.ReadLayoutpassedpassed
KLayout.CheckTopLevelpassedpassed
KLayout.CheckSizepassedpassed
KLayout.CheckPadMaskpassedpassed
KLayout.GenerateIDpassedpassed
KLayout.Renderpassedpassed
KLayout.Densitypassedpassed
Checker.KLayoutDensitypassedpassed
KLayout.ZeroAreaPolygonspassedpassed
Checker.KLayoutZeroAreaPolygonspassedpassed
KLayout.Antennapassedpassed
Checker.KLayoutAntennapassedpassed
Magic.DRCpassedpassed
Checker.MagicDRCpassedpassed
KLayout.DRCpassedpassed
Checker.KLayoutDRCpassedpassed
KLayout.WriteLayoutpassedpassed
KLayout DRC errors00
Magic DRC errors (advisory)00
Filessteps · log (gzip)steps · log (gzip)

The steps of the gf180mcu-precheck LibreLane flow, as run by platform.wafer.space. The design was accepted on the newest finished check before it was submitted; later re-runs check the same file with updated rules. KLayout DRC is the sign-off check. Magic DRC is advisory: its count does not stop a design. In the logs, Magic's "Error while reading cell" lines about fill cells are messages from its reader, not check failures.

Want a chip of your own like this one?

wafer.space Run 3 takes orders until 9 December 2026. Or start smaller with Tiny Tapeout: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3.