Tiny Tapeout GF 0.3 · Die T0P3 on wafer.space Run 2

256x8 SRAM

256 · Other digital · 1 × 2 tiles

by Julia Desmazes

Rendered from the layout at 0.33 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

96 logic cells: too few for density figures, which are given for projects of 1,000 or more.

Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.

256x8 SRAM for testing

Size347 × 325 µm (0.113 mm²)
Macrott_um_essen
Filesdocumentation · licence · layout and netlist in Tiny Tapeout GF 0.3
Tiles1 × 2 at column 3, row 5 of the tile grid
Mux address256
LanguageVerilog
Clock50 MHz
Built withLibreLane 3.0.3, open_pdks 54435919abff
Transistors25,949
Logic cells96 + 1,226 filler and tap cells
Libraries 7t-5V (96)
SRAM1 macro, 2,048 bits

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

3.3 Vocd SRAM
5 V7t-5V standard cells
Gate oxidesThin (3.3 V) and thick (5 V/6 V) in the design itself

Where the area went

How this project's area splits between logic cells, SRAM, filler and tap cells and other.

59%
25%
13%
  • Logic cells 4,511 µm² (4%)
  • SRAM 0.07 mm² (59%)
  • Filler and tap cells 0.03 mm² (25%)
  • Other 0.01 mm² (13%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
and2_17t-5V 232-input AND gate
dlyb_17t-5V 21Delay buffer
dlyc_17t-5V 16Delay buffer
dffq_17t-5V 15D flip-flop (1 bit storage)
dffq_27t-5V 9D flip-flop (1 bit storage, 2x drive)
clkbuf_167t-5V 8Clock buffer (16x drive)
clkinv_17t-5V 2Clock inverter
buf_27t-5V 1Buffer (2x drive)
nand2_17t-5V 12-input NAND gate

SRAM macros

The ready-made memory blocks this design uses.

MacroCountBits each
gf180mcu_ocd_ip_sram__sram256x8m8wm11 2,048

Want your own design on a chip like this one?

Start with a tile: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3. For a die of your own, wafer.space Run 3 takes orders until 9 December 2026.

Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.