Google GF180MCU test shuttle (MPW‑18H1) · Made on a private GlobalFoundries MPW run

Fitbit test IC 1

0003 · Test structures · 1 × 1 slot

Rendered from the layout at 2.5 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

800 logic cells: too few for density figures, which are given for designs of 1,000 or more.

Every figure here is measured from the public layout, the same way for every design on the run: see data and method, and how its designs used the process.

Die3.93 × 5.12 mm (20.1 mm²)
Core area9.00 mm² inside the pad ring
its user_project_wrapper cell
Placements1 on the reticle 0003 on the reticle
Bond pads63
Probe pads44
Transistors113,117
Logic cells800 + 17,709 filler and tap cells
Libraries 7t-5V (800)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

3.3 V7,590 custom transistors
5 V7t-5V standard cells
Gate oxidesThin (3.3 V) and thick (5 V/6 V) in the design itself
MIM capacitors4 (4,800 µm², between Metal4 and Metal5)
Unsalicided poly resistors2 (18 µm²)

Where the area went

How this design's area splits between logic cells, filler and tap cells, other and outside the user area.

42%
55%
  • Logic cells 0.02 mm² (<1%)
  • Filler and tap cells 0.47 mm² (2%)
  • Other 8.51 mm² (42%)
  • Outside the user area 11.12 mm² (55%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
clkbuf_17t-5V 137Clock buffer
clkbuf_37t-5V 136Clock buffer (3x drive)
buf_17t-5V 67Buffer
nor2_17t-5V 582-input NOR gate
dlyb_17t-5V 49Delay buffer
dffq_17t-5V 45D flip-flop (1 bit storage)
clkbuf_27t-5V 30Clock buffer (2x drive)
aoi21_17t-5V 25AND-OR-Invert compound gate
mux2_27t-5V 212-input multiplexer (2x drive)
nor2_27t-5V 212-input NOR gate (2x drive)

Want a chip of your own like this one?

wafer.space Run 3 takes orders until 9 December 2026. Or start smaller with Tiny Tapeout: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3.