Google GF180MCU test shuttle (MPW‑18H1) · Made on a private GlobalFoundries MPW run

LibreSilicon Danube River test tile

0001 · Test structures · 1 × 1 slot

Rendered from the layout at 2.5 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Every figure here is measured from the public layout, the same way for every design on the run: see data and method, and how its designs used the process.

GF180MCU test structures by Philipp Gühring of LibreSilicon; Silicon Prawn identifies the die as LibreSilicon's Danube River test tile (https://gitlab.libresilicon.com/generator-tools/danube-river).

Die3.93 × 5.12 mm (20.1 mm²)
Core area9.00 mm² inside the pad ring
its user_project_wrapper cell
Placements1 on the reticle 0001 on the reticle
Bond pads63
Probe pads460
Pad-layer labels1,814 letters cut through the passivation
Transistors0
Logic cells0
SRAMNo SRAM

Where the area went

How this design's area splits between other and outside the user area.

45%
55%
  • Other 9.00 mm² (45%)
  • Outside the user area 11.12 mm² (55%)

The fabricated die

A photograph of the finished chip, taken through a microscope after manufacture: optical micrograph © 2025 John McMaster, CC BY 4.0

As shipped

How the dies were packed, photographed © 2025 John McMaster, CC BY 4.0

Want a chip of your own like this one?

wafer.space Run 3 takes orders until 9 December 2026. Or start smaller with Tiny Tapeout: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3.