Tiny Tapeout GF 0.3 · Die T0P3 on wafer.space Run 2
GF BGR
260 · Analog and mixed-signal · 1 × 2 tiles
by Rahul Bhagwat · repository @bhagwat-rahul
Rendered from the layout at 0.33 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings
Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.
Bandgap Reference
Source repository Its page on Tiny TapeoutBuy a chip and board
| Size | 329 × 325 µm (0.107 mm²) |
|---|---|
| Macro | tt_um_rahulbhagwat_gf180_bandgap_reference |
| Files | documentation · layout and netlist in Tiny Tapeout GF 0.3 |
| Tiles | 1 × 2 at column 1, row 5 of the tile grid |
| Mux address | 260 |
| Language | Analog |
| Transistors | 15 |
| Logic cells | 0 |
| SRAM | No SRAM |
Process features
Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.
| 3.3 V | 15 custom transistors |
|---|---|
| Gate oxides | Thin only (3.3 V) in the design itself |
| High-resistance poly resistors | 3 (203 µm²) |
| Deep N-well | 9 (1,253 µm²) |
| Bipolar transistors | 9 (225 µm²) |
Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.