Tiny Tapeout GF 0.3 · Die T0P3 on wafer.space Run 2

MoM capacitor

039 · Analog and mixed-signal · 1 × 2 tiles

by htfab

Rendered from the layout at 0.33 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.

Simple metal-oxide-metal capacitor for gf180mcuD that fills an analog 1x2 tile

Size347 × 325 µm (0.113 mm²)
Macrott_um_htfab_momcap
Filesdocumentation · licence · layout and netlist in Tiny Tapeout GF 0.3
Tiles1 × 2 at column 0, row 11 of the tile grid
Mux address39
LanguageAnalog
Transistors0
Logic cells0
SRAMNo SRAM

Where the area went

All of this project's area is other.

100%
  • Other 0.12 mm² (100%)

Want your own design on a chip like this one?

Start with a tile: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3. For a die of your own, wafer.space Run 3 takes orders until 9 December 2026.

Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.