Google GF180MCU open shuttle (GFMPW‑0) · Run by Google and Efabless

OpenFASoC test structures in GF180MCU

F4D8 · Test structures · 1 × 1 slot

Rendered from the layout at 2.5 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

727 logic cells: too few for density figures, which are given for designs of 1,000 or more.

Every figure here is measured from the public layout, the same way for every design on the run: see data and method, and how its designs used the process.

Not this design's layout. The final layout published for this slot holds only Caravel's template example user project, a small counter, not the design described below. So the figures on this page measure that example.

OpenFASoC test structures.

Die3.93 × 5.12 mm (20.1 mm²)
Core area9.00 mm² inside the pad ring
its user_project_wrapper cell
Placements1 on the reticle, in slot D1 F4D8 on the reticle
Bond pads63
Transistors109,729
Logic cells727 + 15,874 filler and tap cells
Libraries 7t-5V (727)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this design's area splits between logic cells, filler and tap cells, other and outside the user area.

42%
55%
  • Logic cells 0.02 mm² (<1%)
  • Filler and tap cells 0.49 mm² (2%)
  • Other 8.49 mm² (42%)
  • Outside the user area 11.12 mm² (55%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
clkbuf_17t-5V 245Clock buffer
clkbuf_47t-5V 134Clock buffer (4x drive)
nor2_17t-5V 792-input NOR gate
dffq_17t-5V 49D flip-flop (1 bit storage)
aoi21_17t-5V 25AND-OR-Invert compound gate
mux2_27t-5V 212-input multiplexer (2x drive)
nand2_17t-5V 202-input NAND gate
aoi222_17t-5V 19AND-OR-Invert (2x2x2 inputs)
dffq_27t-5V 16D flip-flop (1 bit storage, 2x drive)
xor2_17t-5V 152-input XOR gate

The fabricated die

A photograph of the finished chip, taken through a microscope after manufacture: optical micrograph © 2025 John McMaster, CC BY 4.0

Want a chip of your own like this one?

wafer.space Run 3 takes orders until 9 December 2026. Or start smaller with Tiny Tapeout: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3.