Google GF180MCU open shuttle (GFMPW‑0) · Run by Google and Efabless

GF180 state machine

8455 · Other digital · 1 × 1 slot

Rendered from the layout at 2.5 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

88 logic cells: too few for density figures, which are given for designs of 1,000 or more.

Every figure here is measured from the public layout, the same way for every design on the run: see data and method, and how its designs used the process.

Die3.93 × 5.12 mm (20.1 mm²)
Core area9.00 mm² inside the pad ring
its user_project_wrapper cell
Placements1 on the reticle, in slot D8 8455 on the reticle
Bond pads63
Transistors109,567
Logic cells88 + 13,991 filler and tap cells
Libraries 7t-5V (88)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this design's area splits between filler and tap cells, other and outside the user area.

42%
55%
  • Filler and tap cells 0.50 mm² (2%)
  • Other 8.49 mm² (42%)
  • Outside the user area 11.12 mm² (55%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
nand2_17t-5V 122-input NAND gate
clkinv_17t-5V 8Clock inverter
aoi21_17t-5V 6AND-OR-Invert compound gate
dffq_17t-5V 6D flip-flop (1 bit storage)
nor2_17t-5V 62-input NOR gate
clkbuf_17t-5V 5Clock buffer
dlyb_17t-5V 5Delay buffer
oai21_17t-5V 5OR-AND-Invert compound gate
and4_17t-5V 44-input AND gate
buf_17t-5V 4Buffer

Want a chip of your own like this one?

wafer.space Run 3 takes orders until 9 December 2026. Or start smaller with Tiny Tapeout: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3.