Google GF180MCU open shuttle (GFMPW‑0) · Run by Google and Efabless

PWM / Wishbone core

8BB5 · Other digital · 1 × 1 slot

Rendered from the layout at 2.5 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Core average
logic cells per mm²
<1k (<1% of buffer maximum)
Densest mm²
logic cells per mm²
2k (3% of buffer maximum)
Core covered by logic1%
Transistor density
transistors per mm²
12k average, 108k in the mm² with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the run: see data and method, and how its designs used the process.

Eight synchronised 8-bit programmable PWMs controlled by a Wishbone slave interface.

Die3.93 × 5.12 mm (20.1 mm²)
Core area9.00 mm² inside the pad ring
its user_project_wrapper cell
Placements1 on the reticle, in slot E8 8BB5 on the reticle
Bond pads63
Transistors108,042
Logic cells2,471 + 24,410 filler and tap cells
Libraries 7t-5V (2k)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this design's area splits between logic cells, filler and tap cells, other and outside the user area.

42%
55%
  • Logic cells 0.06 mm² (<1%)
  • Filler and tap cells 0.44 mm² (2%)
  • Other 8.49 mm² (42%)
  • Outside the user area 11.12 mm² (55%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
clkbuf_17t-5V 610Clock buffer
mux4_17t-5V 2314-input multiplexer
clkinv_17t-5V 171Clock inverter
oai21_17t-5V 146OR-AND-Invert compound gate
buf_17t-5V 145Buffer
dffq_17t-5V 145D flip-flop (1 bit storage)
nor2_17t-5V 1152-input NOR gate
aoi22_17t-5V 109AND-OR-Invert (2x2 inputs)
nand2_17t-5V 1042-input NAND gate
and2_17t-5V 802-input AND gate

Logic density map

0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 1,294 logic cells, 41,622 transistors 1,177 logic cells, 66,420 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors Densest SRAM-free mm²: 2,471 logic cells 0 0 0 0 0 0 0 0 0 0 0 0 0 1k 1k 0 0 0 0 0

Logic cells per mm² in each square millimetre of the die. Hatched outlines are SRAM macros; the red outline is the densest mm² that avoids them (2k logic cells per mm²), found by sliding a 1 mm square over the die in 0.1 mm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Want a chip of your own like this one?

wafer.space Run 3 takes orders until 9 December 2026. Or start smaller with Tiny Tapeout: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3.