Google GF180MCU open shuttle (GFMPW‑0) · Run by Google and Efabless

HyperRAM controller

1E9A · Other digital · 1 × 1 slot

Rendered from the layout at 2.5 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Core average
logic cells per mm²
<1k (<1% of buffer maximum)
Densest mm²
logic cells per mm²
1k (2% of buffer maximum)
Core covered by logic<1%
Transistor density
transistors per mm²
3k average, 31k in the mm² with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the run: see data and method, and how its designs used the process.

Wishbone connected HyperRAM controller.

Die3.93 × 5.12 mm (20.1 mm²)
Core area9.00 mm² inside the pad ring
its user_project_wrapper cell
Placements1 on the reticle, in slot D6 1E9A on the reticle
Bond pads63
Transistors30,657
Logic cells1,155 + 8,477 filler and tap cells
Libraries 7t-5V (1k)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this design's area splits between logic cells, filler and tap cells, other and outside the user area.

44%
55%
  • Logic cells 0.03 mm² (<1%)
  • Filler and tap cells 0.11 mm² (1%)
  • Other 8.85 mm² (44%)
  • Outside the user area 11.12 mm² (55%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
nor2_17t-5V 1842-input NOR gate
dffq_17t-5V 112D flip-flop (1 bit storage)
oai21_17t-5V 103OR-AND-Invert compound gate
aoi21_17t-5V 75AND-OR-Invert compound gate
nand2_17t-5V 752-input NAND gate
dlyb_17t-5V 64Delay buffer
clkinv_17t-5V 59Clock inverter
clkbuf_37t-5V 55Clock buffer (3x drive)
aoi211_17t-5V 49AND-OR-Invert compound gate
buf_27t-5V 45Buffer (2x drive)

Logic density map

0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 1,008 logic cells, 27,503 transistors 147 logic cells, 3,154 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors Densest SRAM-free mm²: 1,155 logic cells 0 0 0 0 0 0 0 0 0 0 0 0 0 1k <1k 0 0 0 0 0

Logic cells per mm² in each square millimetre of the die. Hatched outlines are SRAM macros; the red outline is the densest mm² that avoids them (1k logic cells per mm²), found by sliding a 1 mm square over the die in 0.1 mm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Want a chip of your own like this one?

wafer.space Run 3 takes orders until 9 December 2026. Or start smaller with Tiny Tapeout: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3.