Google GF180MCU open shuttle (GFMPW‑0) · Run by Google and Efabless

SkullFET

14FB · Analog and mixed-signal · 1 × 1 slot

Rendered from the layout at 2.5 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Every figure here is measured from the public layout, the same way for every design on the run: see data and method, and how its designs used the process.

SkullFET barebone transistor cells (inverter, NAND). By Uri Shaked.

Die3.93 × 5.12 mm (20.1 mm²)
Core area9.00 mm² inside the pad ring
its user_project_wrapper cell
Placements1 on the reticle, in slot E2 14FB on the reticle
Bond pads63
Transistors6
Logic cells0
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

6 V6 custom transistors
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this design's area splits between other and outside the user area.

45%
55%
  • Other 9.00 mm² (45%)
  • Outside the user area 11.12 mm² (55%)

Want a chip of your own like this one?

wafer.space Run 3 takes orders until 9 December 2026. Or start smaller with Tiny Tapeout: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3.