Tiny Tapeout GF 26a · Die T26A on wafer.space Run 2

Simon Says memory game

355 · Games · 1 × 1 tile

by Uri Shaked

Rendered from the layout at 0.33 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Core average
logic cells per mm²
23k (31% of buffer maximum)
Densest 0.1 mm square
logic cells per mm²
37k (49% of buffer maximum)
Core covered by logic64%
Transistor density
transistors per mm²
239k average, 328k in the 0.1 mm square with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.

Repeat the sequence of colors and sounds to win the game

Size347 × 161 µm (0.056 mm²)
Macrott_um_urish_simon
Filesdocumentation · licence · layout and netlist in Tiny Tapeout GF 26a
Tiles1 × 1 at column 5, row 15 of the tile grid
Mux address355
LanguageVerilog
Clock50 kHz
Built withLibreLane 3.0.3, open_pdks 54435919abff
Transistors13,356
Logic cells1,301 + 1,358 filler and tap cells
Libraries 7t-5V (1k)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this project's area splits between logic cells, filler and tap cells and other.

64%
29%
  • Logic cells 0.04 mm² (64%)
  • Filler and tap cells 0.02 mm² (29%)
  • Other 4,033 µm² (7%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
nand2_17t-5V 1792-input NAND gate
dffq_17t-5V 160D flip-flop (1 bit storage)
nor2_17t-5V 1482-input NOR gate
clkinv_17t-5V 86Clock inverter
aoi21_17t-5V 72AND-OR-Invert compound gate
oai21_17t-5V 67OR-AND-Invert compound gate
dlyb_17t-5V 56Delay buffer
nand3_17t-5V 523-input NAND gate
xor2_17t-5V 442-input XOR gate
mux2_27t-5V 372-input multiplexer (2x drive)

Logic density map

170 logic cells, 1,664 transistors 287 logic cells, 3,296 transistors 343 logic cells, 3,079 transistors 63 logic cells, 668 transistors 49 logic cells, 530 transistors 176 logic cells, 1,953 transistors 193 logic cells, 1,908 transistors 20 logic cells, 258 transistors Densest SRAM-free 0.1 mm square: 372 logic cells 17k 29k 34k 5k 18k 19k

Logic cells per mm² in each 0.1 mm square of the project (counted in the square, scaled up to a mm²). Hatched outlines are SRAM macros; the red outline is the densest 0.1 mm square that avoids them (37k logic cells per mm²), found by sliding a 0.1 mm square over the project in 20 µm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Want your own design on a chip like this one?

Start with a tile: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3. For a die of your own, wafer.space Run 3 takes orders until 9 December 2026.

Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.