Tiny Tapeout GF 26a · Die T26A on wafer.space Run 2

Custom DVD Screensaver for VGA

102 · Retro computing · 1 × 1 tile

by Jazmin Nayeli / Kensy Buatista

Rendered from the layout at 0.33 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Core average
logic cells per mm²
19k (24% of buffer maximum)
Densest 0.1 mm square
logic cells per mm²
28k (37% of buffer maximum)
Core covered by logic48%
Transistor density
transistors per mm²
263k average, 292k in the 0.1 mm square with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.

Bouncing DVD logo on VGA with color change on wall hits, speed control, invert, and flip options

Size347 × 161 µm (0.056 mm²)
Macrott_um_uacj
Filesdocumentation · licence · layout and netlist in Tiny Tapeout GF 26a
Tiles1 × 1 at column 7, row 10 of the tile grid
Mux address102
LanguageVerilog
Clock25.175 MHz
Built withLibreLane 3.0.0, open_pdks 54435919abff
Transistors14,728
Logic cells1,039 + 1,941 filler and tap cells
Libraries 7t-5V (1k)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this project's area splits between logic cells, filler and tap cells and other.

48%
45%
  • Logic cells 0.03 mm² (48%)
  • Filler and tap cells 0.02 mm² (45%)
  • Other 4,033 µm² (7%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
nand2_17t-5V 932-input NAND gate
aoi21_17t-5V 80AND-OR-Invert compound gate
nor2_17t-5V 722-input NOR gate
oai21_17t-5V 69OR-AND-Invert compound gate
buf_27t-5V 57Buffer (2x drive)
dlyb_17t-5V 54Delay buffer
dffq_17t-5V 52D flip-flop (1 bit storage)
oai211_17t-5V 41OR-AND-Invert compound gate
xor2_17t-5V 392-input XOR gate
clkinv_17t-5V 38Clock inverter

Logic density map

155 logic cells, 2,447 transistors 276 logic cells, 2,892 transistors 207 logic cells, 2,717 transistors 63 logic cells, 1,156 transistors 46 logic cells, 1,345 transistors 133 logic cells, 1,864 transistors 133 logic cells, 1,683 transistors 26 logic cells, 624 transistors Densest SRAM-free 0.1 mm square: 281 logic cells 15k 28k 21k 5k 13k 13k

Logic cells per mm² in each 0.1 mm square of the project (counted in the square, scaled up to a mm²). Hatched outlines are SRAM macros; the red outline is the densest 0.1 mm square that avoids them (28k logic cells per mm²), found by sliding a 0.1 mm square over the project in 20 µm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Want your own design on a chip like this one?

Start with a tile: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3. For a die of your own, wafer.space Run 3 takes orders until 9 December 2026.

Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.