Tiny Tapeout GF 0.3 · Die T0P3 on wafer.space Run 2

algofoogle analog stuff

037 · Analog and mixed-signal · 1 × 2 tiles

by algofoogle (Anton Maurovic)

Rendered from the layout at 0.33 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

695 logic cells: too few for density figures, which are given for projects of 1,000 or more.

Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.

Some analog and custom layout experiments in gf180mcuD for ttgf0p3 (the TT GF 1st analog experimental shuttle)

Size347 × 325 µm (0.113 mm²)
Macrott_um_algofoogle_gf_analog
Filesdocumentation · licence · layout and netlist in Tiny Tapeout GF 0.3
Tiles1 × 2 at column 1, row 11 of the tile grid
Mux address37
LanguageAnalog
Transistors13,000
Logic cells695 + 1,897 filler and tap cells
Libraries 7t-5V (695)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

3.3 V122 custom transistors
5 V7t-5V standard cells
Gate oxidesThin (3.3 V) and thick (5 V/6 V) in the design itself
High-resistance poly resistors34 (740 µm²)

Where the area went

How this project's area splits between logic cells, filler and tap cells and other.

18%
23%
59%
  • Logic cells 0.02 mm² (18%)
  • Filler and tap cells 0.03 mm² (23%)
  • Other 0.07 mm² (59%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
nor2_17t-5V 592-input NOR gate
dffq_17t-5V 56D flip-flop (1 bit storage)
clkinv_17t-5V 54Clock inverter
dlyb_17t-5V 42Delay buffer
nand2_17t-5V 412-input NAND gate
aoi21_17t-5V 33AND-OR-Invert compound gate
buf_27t-5V 26Buffer (2x drive)
oai21_17t-5V 25OR-AND-Invert compound gate
dffq_27t-5V 19D flip-flop (1 bit storage, 2x drive)
dffq_47t-5V 19D flip-flop (1 bit storage, 4x drive)

Want your own design on a chip like this one?

Start with a tile: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3. For a die of your own, wafer.space Run 3 takes orders until 9 December 2026.

Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.