Google GF180MCU open shuttle (GFMPW‑0) · Run by Google and Efabless

Pyramiden Core (RV16U)

F0DD · RISC-V and CPUs · 1 × 1 slot

Rendered from the layout at 2.5 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Core average
logic cells per mm²
<1k (1% of buffer maximum)
Densest mm²
logic cells per mm²
4k (5% of buffer maximum)
Core covered by logic1%
Transistor density
transistors per mm²
9k average, 81k in the mm² with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the run: see data and method, and how its designs used the process.

16-bit RISC-V microcore processor with 21-bit instructions and 16 registers. By David Richie (Brown Deer Technology).

Die3.93 × 5.12 mm (20.1 mm²)
Core area9.00 mm² inside the pad ring
its user_project_wrapper cell
Placements1 on the reticle, in slot A7 F0DD on the reticle
Bond pads63
Transistors81,479
Logic cells3,874 + 25,899 filler and tap cells
Libraries 7t-5V (4k)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this design's area splits between logic cells, filler and tap cells, other and outside the user area.

43%
55%
  • Logic cells 0.09 mm² (<1%)
  • Filler and tap cells 0.29 mm² (1%)
  • Other 8.62 mm² (43%)
  • Outside the user area 11.12 mm² (55%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
clkbuf_17t-5V 710Clock buffer
nand2_17t-5V 4802-input NAND gate
dffq_17t-5V 401D flip-flop (1 bit storage)
oai21_17t-5V 400OR-AND-Invert compound gate
nor2_17t-5V 2052-input NOR gate
aoi22_17t-5V 187AND-OR-Invert (2x2 inputs)
aoi21_17t-5V 176AND-OR-Invert compound gate
buf_17t-5V 142Buffer
dlyb_17t-5V 101Delay buffer
clkinv_17t-5V 99Clock inverter

Logic density map

0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 705 logic cells, 11,324 transistors 489 logic cells, 9,374 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 1,571 logic cells, 32,800 transistors 1,109 logic cells, 27,981 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors Densest SRAM-free mm²: 3,874 logic cells 0 0 0 0 0 0 0 0 0 1k <1k 0 0 2k 1k 0 0 0 0 0

Logic cells per mm² in each square millimetre of the die. Hatched outlines are SRAM macros; the red outline is the densest mm² that avoids them (4k logic cells per mm²), found by sliding a 1 mm square over the die in 0.1 mm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Want a chip of your own like this one?

wafer.space Run 3 takes orders until 9 December 2026. Or start smaller with Tiny Tapeout: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3.