Google GF180MCU open shuttle (GFMPW‑0) · Run by Google and Efabless

EduRISC16

E91D · RISC-V and CPUs · 1 × 1 slot

Rendered from the layout at 2.5 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Core average
logic cells per mm²
<1k (<1% of buffer maximum)
Densest mm²
logic cells per mm²
2k (3% of buffer maximum)
Core covered by logic<1%
Transistor density
transistors per mm²
23k average, 189k in the mm² with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the run: see data and method, and how its designs used the process.

A 16-bit RISC themed processor for educational purposes. By Ryan Price.

Die3.93 × 5.12 mm (20.1 mm²)
Core area9.00 mm² inside the pad ring
its user_project_wrapper cell
Placements1 on the reticle, in slot C3 E91D on the reticle
Bond pads63
Transistors207,791
Logic cells2,034 + 31,767 filler and tap cells
Libraries 7t-5V (2k)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this design's area splits between logic cells, filler and tap cells, other and outside the user area.

40%
55%
  • Logic cells 0.04 mm² (<1%)
  • Filler and tap cells 0.91 mm² (5%)
  • Other 8.04 mm² (40%)
  • Outside the user area 11.12 mm² (55%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
xor2_17t-5V 2282-input XOR gate
clkbuf_17t-5V 218Clock buffer
nand2_17t-5V 1942-input NAND gate
nor2_17t-5V 1842-input NOR gate
buf_17t-5V 138Buffer
aoi21_17t-5V 134AND-OR-Invert compound gate
oai21_17t-5V 118OR-AND-Invert compound gate
xnor2_17t-5V 942-input XNOR gate
and2_17t-5V 602-input AND gate
clkinv_17t-5V 55Clock inverter

Logic density map

0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 3 logic cells, 36,628 transistors 0 logic cells, 33,056 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 1,998 logic cells, 72,721 transistors 33 logic cells, 65,386 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors Densest SRAM-free mm²: 2,004 logic cells 0 0 0 0 0 0 0 0 0 <1k 0 0 0 2k <1k 0 0 0 0 0

Logic cells per mm² in each square millimetre of the die. Hatched outlines are SRAM macros; the red outline is the densest mm² that avoids them (2k logic cells per mm²), found by sliding a 1 mm square over the die in 0.1 mm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Want a chip of your own like this one?

wafer.space Run 3 takes orders until 9 December 2026. Or start smaller with Tiny Tapeout: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3.