Google GF180MCU open shuttle (GFMPW‑0) · Run by Google and Efabless

VerilogBoy

C979 · RISC-V and CPUs · 1 × 1 slot

Rendered from the layout at 2.5 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Core average
logic cells per mm²
3k (4% of buffer maximum)
Densest mm²
logic cells per mm²
18k (24% of buffer maximum)
Core covered by logic8%
Transistor density
transistors per mm²
55k average, 230k in the mm² with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the run: see data and method, and how its designs used the process.

GameBoy-compatible system (SM83 CPU core, pixel processing unit) from the VerilogBoy project.

Die3.93 × 5.12 mm (20.1 mm²)
Core area9.00 mm² inside the pad ring
its user_project_wrapper cell
Placements1 on the reticle, in slot D3 C979 on the reticle
Bond pads63
Transistors492,322
Logic cells27,097 + 148,645 filler and tap cells
Libraries 7t-5V (27k)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this design's area splits between logic cells, filler and tap cells, other and outside the user area.

34%
55%
  • Logic cells 0.72 mm² (4%)
  • Filler and tap cells 1.45 mm² (7%)
  • Other 6.82 mm² (34%)
  • Outside the user area 11.12 mm² (55%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
clkbuf_17t-5V 4,728Clock buffer
nand2_17t-5V 4,0352-input NAND gate
dffq_17t-5V 3,890D flip-flop (1 bit storage)
oai21_17t-5V 3,516OR-AND-Invert compound gate
buf_17t-5V 1,295Buffer
nor2_17t-5V 1,0942-input NOR gate
clkbuf_167t-5V 922Clock buffer (16x drive)
aoi21_17t-5V 840AND-OR-Invert compound gate
clkinv_17t-5V 832Clock inverter
mux2_27t-5V 6522-input multiplexer (2x drive)

Logic density map

0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 1,242 logic cells, 37,422 transistors 476 logic cells, 68,977 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 7,839 logic cells, 114,950 transistors 15,864 logic cells, 225,009 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 76 logic cells, 15,594 transistors 1,600 logic cells, 30,370 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors Densest SRAM-free mm²: 18,124 logic cells 0 0 0 0 0 0 0 0 0 1k <1k 0 0 8k 16k 0 0 <1k 2k 0

Logic cells per mm² in each square millimetre of the die. Hatched outlines are SRAM macros; the red outline is the densest mm² that avoids them (18k logic cells per mm²), found by sliding a 1 mm square over the die in 0.1 mm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Want a chip of your own like this one?

wafer.space Run 3 takes orders until 9 December 2026. Or start smaller with Tiny Tapeout: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3.