Google GF180MCU open shuttle (GFMPW‑0) · Run by Google and Efabless

SPELL for GF180

B676 · Other digital · 1 × 1 slot

Rendered from the layout at 2.5 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Core average
logic cells per mm²
1k (1% of buffer maximum)
Densest mm²
logic cells per mm²
6k (9% of buffer maximum)
Core covered by logic2%
Transistor density
transistors per mm²
19k average, 170k in the mm² with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the run: see data and method, and how its designs used the process.

SPELL, a minimalist stack-based programming language from The Skull CTF, implemented in Verilog (verispell).

Die3.93 × 5.12 mm (20.1 mm²)
Core area9.00 mm² inside the pad ring
its user_project_wrapper cell
Placements1 on the reticle, in slot A3 B676 on the reticle
Bond pads63
Transistors170,147
Logic cells6,463 + 42,067 filler and tap cells
Libraries 7t-5V (6k)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this design's area splits between logic cells, filler and tap cells, other and outside the user area.

41%
55%
  • Logic cells 0.17 mm² (1%)
  • Filler and tap cells 0.60 mm² (3%)
  • Other 8.23 mm² (41%)
  • Outside the user area 11.12 mm² (55%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
clkbuf_17t-5V 1,150Clock buffer
dffq_17t-5V 752D flip-flop (1 bit storage)
oai21_17t-5V 602OR-AND-Invert compound gate
aoi22_17t-5V 444AND-OR-Invert (2x2 inputs)
aoi21_17t-5V 440AND-OR-Invert compound gate
clkinv_17t-5V 426Clock inverter
nand2_17t-5V 3982-input NAND gate
buf_17t-5V 307Buffer
nor2_17t-5V 2952-input NOR gate
clkbuf_167t-5V 182Clock buffer (16x drive)

Logic density map

0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 5,839 logic cells, 142,075 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 624 logic cells, 28,072 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors Densest SRAM-free mm²: 6,463 logic cells 0 0 0 0 0 0 0 0 0 6k 0 0 0 1k 0 0 0 0 0 0

Logic cells per mm² in each square millimetre of the die. Hatched outlines are SRAM macros; the red outline is the densest mm² that avoids them (6k logic cells per mm²), found by sliding a 1 mm square over the die in 0.1 mm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Want a chip of your own like this one?

wafer.space Run 3 takes orders until 9 December 2026. Or start smaller with Tiny Tapeout: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3.