Tiny Tapeout GF 26a · Die T26A on wafer.space Run 2

VCO driven by DAC

609 · Analog and mixed-signal · 1 × 1 tile

by algofoogle (Anton Maurovic)

Rendered from the layout at 0.33 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

48 logic cells: too few for density figures, which are given for projects of 1,000 or more.

Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.

Mixed-signal project with DAC setting a VCO's control voltage

Size347 × 161 µm (0.056 mm²)
Macrott_um_algofoogle_ttgf26a_vco
Filesdocumentation · licence · layout and netlist in Tiny Tapeout GF 26a
Tiles1 × 1 at column 4, row 19 of the tile grid
Mux address609
LanguageAnalog/Mixed
Transistors2,583
Logic cells48 + 347 filler and tap cells
Libraries 9t-5V (48)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

3.3 V51 custom transistors
5 V9t-5V standard cells
Gate oxidesThin (3.3 V) and thick (5 V/6 V) in the design itself
High-resistance poly resistors32 (190 µm²)

Where the area went

How this project's area splits between logic cells, filler and tap cells and other.

20%
76%
  • Logic cells 2,196 µm² (4%)
  • Filler and tap cells 0.01 mm² (20%)
  • Other 0.04 mm² (76%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
buf_19t-5V 9Buffer
clkinv_39t-5V 9Clock inverter (3x drive)
clkbuf_169t-5V 5Clock buffer (16x drive)
aoi21_19t-5V 3AND-OR-Invert compound gate
clkinv_19t-5V 3Clock inverter
dffq_49t-5V 3D flip-flop (1 bit storage, 4x drive)
nor2_19t-5V 32-input NOR gate
buf_49t-5V 2Buffer (4x drive)
dffq_29t-5V 2D flip-flop (1 bit storage, 2x drive)
nand2_19t-5V 22-input NAND gate

Want your own design on a chip like this one?

Start with a tile: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3. For a die of your own, wafer.space Run 3 takes orders until 9 December 2026.

Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.