Tiny Tapeout GF 26a · Die T26A on wafer.space Run 2

Custom DVD Screensaver for VGA

577 · Retro computing · 1 × 1 tile

by Alan Sigala

Rendered from the layout at 0.33 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Core average
logic cells per mm²
22k (28% of buffer maximum)
Densest 0.1 mm square
logic cells per mm²
29k (38% of buffer maximum)
Core covered by logic54%
Transistor density
transistors per mm²
269k average, 312k in the 0.1 mm square with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.

128x40 bouncing DVD logo with CRT scanlines, checkerboard background, color cycling on wall hits, and random VHS-style corruption effects

Size347 × 161 µm (0.056 mm²)
Macrott_um_uacj_bouncing_DVD_screensaver
Filesdocumentation · licence · layout and netlist in Tiny Tapeout GF 26a
Tiles1 × 1 at column 4, row 0 of the tile grid
Mux address577
LanguageVerilog
Clock25.175 MHz
Built withLibreLane 3.0.0, open_pdks 54435919abff
Transistors15,040
Logic cells1,204 + 2,175 filler and tap cells
Libraries 7t-5V (1k)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this project's area splits between logic cells, filler and tap cells and other.

54%
39%
  • Logic cells 0.03 mm² (54%)
  • Filler and tap cells 0.02 mm² (39%)
  • Other 4,033 µm² (7%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
nand2_17t-5V 1602-input NAND gate
oai21_17t-5V 101OR-AND-Invert compound gate
nor2_17t-5V 842-input NOR gate
aoi21_17t-5V 78AND-OR-Invert compound gate
dffq_17t-5V 68D flip-flop (1 bit storage)
xor2_17t-5V 672-input XOR gate
clkinv_17t-5V 46Clock inverter
dlyb_17t-5V 45Delay buffer
oai211_17t-5V 42OR-AND-Invert compound gate
nand3_17t-5V 363-input NAND gate

Logic density map

160 logic cells, 2,585 transistors 243 logic cells, 2,845 transistors 263 logic cells, 2,814 transistors 98 logic cells, 1,199 transistors 95 logic cells, 1,524 transistors 124 logic cells, 1,676 transistors 155 logic cells, 1,658 transistors 66 logic cells, 739 transistors Densest SRAM-free 0.1 mm square: 290 logic cells 16k 24k 26k 9k 12k 15k

Logic cells per mm² in each 0.1 mm square of the project (counted in the square, scaled up to a mm²). Hatched outlines are SRAM macros; the red outline is the densest 0.1 mm square that avoids them (29k logic cells per mm²), found by sliding a 0.1 mm square over the project in 20 µm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Want your own design on a chip like this one?

Start with a tile: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3. For a die of your own, wafer.space Run 3 takes orders until 9 December 2026.

Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.