Tiny Tapeout GF 26a · Die T26A on wafer.space Run 2

Memristive Crossbar Peripheral Controller (GF180)

547 · Analog and mixed-signal · 1 × 1 tile

by Prof. Santhosh Sivasubramani, IIT Delhi

Rendered from the layout at 0.33 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Core average
logic cells per mm²
22k (29% of buffer maximum)
Densest 0.1 mm square
logic cells per mm²
26k (35% of buffer maximum)
Core covered by logic70%
Transistor density
transistors per mm²
296k average, 323k in the 0.1 mm square with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.

GF180mcuD port of the 8x8 memristive crossbar controller: READ/SET/RESET/FORMING/SWEEP modes, pulse trains, 16-bit pulse counter, compliance auto-abort with sticky history, V/2 half-select DAC, last-ADC-in-sweep snapshot. Direct cross-foundry sibling to the TTSKY26a xbar_ctrl for comparative characterisation.

Size347 × 161 µm (0.056 mm²)
Macrott_um_santhosh_xbar_ctrl_gf
Filesdocumentation · licence · layout and netlist in Tiny Tapeout GF 26a
Tiles1 × 1 at column 2, row 19 of the tile grid
Mux address547
LanguageVerilog
Clock50 MHz
Built withLibreLane 3.0.3, open_pdks 54435919abff
Transistors16,551
Logic cells1,228 + 1,720 filler and tap cells
Libraries 7t-5V (1k)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this project's area splits between logic cells, filler and tap cells and other.

70%
23%
  • Logic cells 0.04 mm² (70%)
  • Filler and tap cells 0.01 mm² (23%)
  • Other 4,033 µm² (7%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
dffrnq_17t-5V 182D flip-flop with reset
mux2_27t-5V 1052-input multiplexer (2x drive)
nand2_17t-5V 992-input NAND gate
clkinv_17t-5V 77Clock inverter
nor2_17t-5V 612-input NOR gate
aoi22_17t-5V 58AND-OR-Invert (2x2 inputs)
dlyb_17t-5V 57Delay buffer
oai21_17t-5V 53OR-AND-Invert compound gate
aoi21_17t-5V 50AND-OR-Invert compound gate
buf_27t-5V 50Buffer (2x drive)

Logic density map

222 logic cells, 3,148 transistors 240 logic cells, 3,041 transistors 239 logic cells, 3,054 transistors 85 logic cells, 1,245 transistors 117 logic cells, 1,753 transistors 132 logic cells, 1,762 transistors 128 logic cells, 1,766 transistors 65 logic cells, 782 transistors Densest SRAM-free 0.1 mm square: 265 logic cells 22k 24k 24k 12k 13k 13k

Logic cells per mm² in each 0.1 mm square of the project (counted in the square, scaled up to a mm²). Hatched outlines are SRAM macros; the red outline is the densest 0.1 mm square that avoids them (26k logic cells per mm²), found by sliding a 0.1 mm square over the project in 20 µm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Want your own design on a chip like this one?

Start with a tile: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3. For a die of your own, wafer.space Run 3 takes orders until 9 December 2026.

Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.