Tiny Tapeout GF 26a · Die T26A on wafer.space Run 2

Tiny Tapeout RJAP

487 · Other digital · 1 × 1 tile

by Rodrigo Álvarez

Rendered from the layout at 0.33 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

28 logic cells: too few for density figures, which are given for projects of 1,000 or more.

Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.

Wokwi Tiny Tapeout Beginner Project

Size347 × 161 µm (0.056 mm²)
Macrott_um_wokwi_465732616714924033
Filesdocumentation · licence · layout and netlist in Tiny Tapeout GF 26a
Tiles1 × 1 at column 7, row 17 of the tile grid
Mux address487
LanguageWokwi
Clock1 Hz
Built withLibreLane 3.0.3, open_pdks 54435919abff
Transistors11,524
Logic cells28 + 1,277 filler and tap cells
Libraries 7t-5V (28)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this project's area splits between logic cells, filler and tap cells and other.

91%
  • Logic cells 1,172 µm² (2%)
  • Filler and tap cells 0.05 mm² (91%)
  • Other 4,033 µm² (7%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
clkbuf_167t-5V 6Clock buffer (16x drive)
dlyb_17t-5V 6Delay buffer
buf_27t-5V 4Buffer (2x drive)
buf_17t-5V 3Buffer
clkinv_17t-5V 2Clock inverter
mux2_27t-5V 22-input multiplexer (2x drive)
and2_17t-5V 12-input AND gate
buf_47t-5V 1Buffer (4x drive)
clkinv_27t-5V 1Clock inverter (2x drive)
clkinv_47t-5V 1Clock inverter (4x drive)

Want your own design on a chip like this one?

Start with a tile: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3. For a die of your own, wafer.space Run 3 takes orders until 9 December 2026.

Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.