Tiny Tapeout GF 26a · Die T26A on wafer.space Run 2

SAP 8 Bit Computer

482 · RISC-V and CPUs · 1 × 1 tile

by Navneet Prasad, Mohammed Riyaj J, Akash P, Vikash R

Rendered from the layout at 0.33 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Core average
logic cells per mm²
22k (29% of buffer maximum)
Densest 0.1 mm square
logic cells per mm²
28k (36% of buffer maximum)
Core covered by logic77%
Transistor density
transistors per mm²
316k average, 355k in the 0.1 mm square with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.

The processor implements a 16-instruction, 8-bit ISA inspired by SAP-style architectures, with support for memory access, immediate operations, arithmetic/logic operations, control flow, and basic input/output

Size347 × 161 µm (0.056 mm²)
Macrott_um_8bitcustomcomputer
Filesdocumentation · licence · layout and netlist in Tiny Tapeout GF 26a
Tiles1 × 1 at column 5, row 16 of the tile grid
Mux address482
LanguageVerilog
Clock10 Hz
Built withLibreLane 3.0.3, open_pdks 54435919abff
Transistors17,672
Logic cells1,214 + 1,320 filler and tap cells
Libraries 7t-5V (1k)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this project's area splits between logic cells, filler and tap cells and other.

77%
16%
  • Logic cells 0.04 mm² (77%)
  • Filler and tap cells 0.01 mm² (16%)
  • Other 4,033 µm² (7%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
dffrnq_17t-5V 167D flip-flop with reset
mux2_27t-5V 1642-input multiplexer (2x drive)
clkbuf_17t-5V 112Clock buffer
dlyb_17t-5V 84Delay buffer
nand2_17t-5V 582-input NAND gate
buf_27t-5V 57Buffer (2x drive)
clkinv_17t-5V 52Clock inverter
aoi22_17t-5V 48AND-OR-Invert (2x2 inputs)
clkbuf_27t-5V 45Clock buffer (2x drive)
nor2_17t-5V 442-input NOR gate

Logic density map

189 logic cells, 2,862 transistors 227 logic cells, 3,226 transistors 227 logic cells, 3,427 transistors 100 logic cells, 1,411 transistors 145 logic cells, 1,827 transistors 150 logic cells, 1,952 transistors 125 logic cells, 2,118 transistors 51 logic cells, 849 transistors Densest SRAM-free 0.1 mm square: 276 logic cells 19k 23k 23k 14k 15k 12k

Logic cells per mm² in each 0.1 mm square of the project (counted in the square, scaled up to a mm²). Hatched outlines are SRAM macros; the red outline is the densest 0.1 mm square that avoids them (28k logic cells per mm²), found by sliding a 0.1 mm square over the project in 20 µm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Want your own design on a chip like this one?

Start with a tile: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3. For a die of your own, wafer.space Run 3 takes orders until 9 December 2026.

Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.