Tiny Tapeout GF 26a · Die T26A on wafer.space Run 2

Stochastic neuron + STDP controller (merged, GF180)

358 · Other digital · 1 × 2 tiles

by Prof. Santhosh Sivasubramani, IIT Delhi

Rendered from the layout at 0.33 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Core average
logic cells per mm²
21k (28% of buffer maximum)
Densest 0.1 mm square
logic cells per mm²
27k (36% of buffer maximum)
Core covered by logic69%
Transistor density
transistors per mm²
299k average, 338k in the 0.1 mm square with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.

GF180mcuD merged-pair cell: an 8-bit saturating LIF/stochastic neuron with an 8-entry sigmoid LUT, 8-bit Galois LFSR, programmable refractory, per-clock leak, host-triggered stimulus on ext_input rising edge, homeostatic theta adaptation over a 256-clock window (theta_live floats between theta_min and theta_max depending on spike count vs reg_target), and a 16-clock Bayesian confidence window emitting a 2-bit conf output. The second block is an STDP controller with 8-bit pre/post spike traces, per-clock exponential-shift decay (reg_tau_plus / reg_tau_minus), an anti-Hebbian polarity bit and optional reward-gated learning; on every LTP event (post spike with pre trace != 0) or LTD event (pre spike with post trace != 0) a 1-cycle weight_update pulse is emitted along with a learn_dir bit and a magnitude latch read over SPI. All registers are programmable via an 8-bit-data SPI mode-0 slave shared with the other TTGF26a tiles. 25 MHz signoff.

Size347 × 325 µm (0.113 mm²)
Macrott_um_santhosh_stoch_stdp_pair_gf
Filesdocumentation · licence · layout and netlist in Tiny Tapeout GF 26a
Tiles1 × 2 at column 7, row 14 of the tile grid
Mux address358
LanguageVerilog
Clock25 MHz
Built withLibreLane 3.0.3, open_pdks 54435919abff
Transistors34,534
Logic cells2,435 + 3,670 filler and tap cells
Libraries 7t-5V (2k)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this project's area splits between logic cells, filler and tap cells and other.

69%
24%
  • Logic cells 0.08 mm² (69%)
  • Filler and tap cells 0.03 mm² (24%)
  • Other 0.01 mm² (7%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
dffrnq_17t-5V 313D flip-flop with reset
mux2_27t-5V 2432-input multiplexer (2x drive)
nand2_17t-5V 1842-input NAND gate
buf_27t-5V 146Buffer (2x drive)
dlyb_17t-5V 146Delay buffer
nor2_17t-5V 1042-input NOR gate
clkbuf_27t-5V 101Clock buffer (2x drive)
oai21_17t-5V 100OR-AND-Invert compound gate
aoi22_17t-5V 96AND-OR-Invert (2x2 inputs)
clkinv_17t-5V 96Clock inverter

Logic density map

166 logic cells, 3,016 transistors 213 logic cells, 3,292 transistors 228 logic cells, 3,132 transistors 68 logic cells, 1,395 transistors 210 logic cells, 3,068 transistors 264 logic cells, 3,378 transistors 247 logic cells, 3,212 transistors 113 logic cells, 1,247 transistors 205 logic cells, 3,020 transistors 219 logic cells, 3,173 transistors 234 logic cells, 3,113 transistors 89 logic cells, 1,276 transistors 47 logic cells, 607 transistors 56 logic cells, 631 transistors 47 logic cells, 680 transistors 29 logic cells, 294 transistors Densest SRAM-free 0.1 mm square: 270 logic cells 17k 21k 23k 21k 26k 25k 20k 22k 23k

Logic cells per mm² in each 0.1 mm square of the project (counted in the square, scaled up to a mm²). Hatched outlines are SRAM macros; the red outline is the densest 0.1 mm square that avoids them (27k logic cells per mm²), found by sliding a 0.1 mm square over the project in 20 µm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Want your own design on a chip like this one?

Start with a tile: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3. For a die of your own, wafer.space Run 3 takes orders until 9 December 2026.

Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.