Tiny Tapeout GF 0.2 · Die TTP2 on wafer.space Run 1: the standard edition

Notre Dame - Lockpick Game TT Example

288 · Games · 1 × 2 tiles

by Matthew Morrison

Rendered from the layout at 0.33 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Core average
logic cells per mm²
24k (31% of buffer maximum)
Densest 0.1 mm square
logic cells per mm²
29k (38% of buffer maximum)
Core covered by logic71%
Transistor density
transistors per mm²
299k average, 336k in the 0.1 mm square with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the chip: see data and method, and how its designs used the process.

An example SystemVerilog Implementation of a pipelined input/output for future TinyTapeout use in the classroom

Size347 × 325 µm (0.113 mm²)
Macrott_um_mmorri22_lockpick_game
Filesdocumentation · licence · layout and netlist in Tiny Tapeout GF 0.2
Tiles1 × 2 at column 3, row 14 of the tile grid
Mux address288
LanguageSystemVerilog
Clock7 MHz
Built withLibreLane 2.4.2, open_pdks 0fe599b2afb6
Transistors34,534
Logic cells2,722 + 3,510 filler and tap cells
Libraries 7t-5V (3k)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this project's area splits between logic cells, filler and tap cells and other.

71%
23%
  • Logic cells 0.08 mm² (71%)
  • Filler and tap cells 0.03 mm² (23%)
  • Other 0.01 mm² (7%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
dffq_17t-5V 507D flip-flop (1 bit storage)
nand2_17t-5V 4152-input NAND gate
oai21_17t-5V 265OR-AND-Invert compound gate
aoi21_17t-5V 236AND-OR-Invert compound gate
nor2_17t-5V 1422-input NOR gate
xor2_17t-5V 1322-input XOR gate
clkinv_17t-5V 105Clock inverter
clkbuf_87t-5V 99Clock buffer (8x drive)
mux2_27t-5V 942-input multiplexer (2x drive)
buf_27t-5V 92Buffer (2x drive)

Logic density map

216 logic cells, 2,819 transistors 260 logic cells, 3,111 transistors 272 logic cells, 3,073 transistors 106 logic cells, 1,298 transistors 227 logic cells, 2,984 transistors 277 logic cells, 3,184 transistors 246 logic cells, 3,140 transistors 107 logic cells, 1,365 transistors 232 logic cells, 3,110 transistors 272 logic cells, 3,445 transistors 230 logic cells, 3,275 transistors 100 logic cells, 1,406 transistors 52 logic cells, 631 transistors 53 logic cells, 662 transistors 51 logic cells, 721 transistors 21 logic cells, 310 transistors Densest SRAM-free 0.1 mm square: 288 logic cells 22k 26k 27k 23k 28k 25k 23k 27k 23k

Logic cells per mm² in each 0.1 mm square of the project (counted in the square, scaled up to a mm²). Hatched outlines are SRAM macros; the red outline is the densest 0.1 mm square that avoids them (29k logic cells per mm²), found by sliding a 0.1 mm square over the project in 20 µm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Want your own design on a chip like this one?

Start with a tile: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3. For a die of your own, wafer.space Run 3 takes orders until 9 December 2026.

Tiny Tapeout and wafer.space are independent companies that work together (announcement). Tiny Tapeout runs its own shuttles: it takes the projects, builds the die, and sells and supports the chips and boards. wafer.space has the dies manufactured on its GF180MCU runs, and these pages are wafer.space's measurements of them. For anything about a Tiny Tapeout project, chip or order, contact Tiny Tapeout.