Google GF180MCU open shuttle (GFMPW‑0) · Run by Google and Efabless

Synchronous modulator

6E0D · Other digital · 1 × 1 slot

Rendered from the layout at 2.5 µm per pixel. Layers: NwellDiffusionPolysiliconMetal 1Metal 2Metal 3Metal 4Metal 5Top metalPad openings

Logic density

Core average
logic cells per mm²
<1k (<1% of buffer maximum)
Densest mm²
logic cells per mm²
2k (2% of buffer maximum)
Core covered by logic<1%
Transistor density
transistors per mm²
2k average, 16k in the mm² with the most logic cells

Every figure here is measured from the public layout, the same way for every design on the run: see data and method, and how its designs used the process.

Synchronous modulator, part of a PhD project at CINVESTAV Guadalajara.

Die3.93 × 5.12 mm (20.1 mm²)
Core area9.00 mm² inside the pad ring
its user_project_wrapper cell
Placements1 on the reticle, in slot B8 6E0D on the reticle
Bond pads63
Transistors15,966
Logic cells1,558 + 7,532 filler and tap cells
Libraries 7t-5V (2k)
SRAMNo SRAM

Process features

Which parts of the GF180MCU process this design uses: its transistor voltages and where they come from, its gate oxides, and any devices drawn by hand outside the standard cells, SRAM and pads.

5 V7t-5V standard cells
Gate oxidesThick only (5 V/6 V) in the design itself

Where the area went

How this design's area splits between logic cells, filler and tap cells, other and outside the user area.

44%
55%
  • Logic cells 0.03 mm² (<1%)
  • Filler and tap cells 0.04 mm² (<1%)
  • Other 8.92 mm² (44%)
  • Outside the user area 11.12 mm² (55%)

Most used cells

The ten standard cells this design uses most.

CellLibraryInstancesWhat it does
clkbuf_17t-5V 185Clock buffer
buf_17t-5V 148Buffer
nand2_17t-5V 1412-input NAND gate
oai21_17t-5V 99OR-AND-Invert compound gate
aoi21_17t-5V 95AND-OR-Invert compound gate
nor2_17t-5V 912-input NOR gate
xor2_17t-5V 582-input XOR gate
and2_17t-5V 462-input AND gate
clkbuf_27t-5V 46Clock buffer (2x drive)
nand3_17t-5V 443-input NAND gate

Logic density map

0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 1,558 logic cells, 15,966 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors 0 logic cells, 0 transistors Densest SRAM-free mm²: 1,558 logic cells 0 0 0 0 0 0 0 0 0 2k 0 0 0 0 0 0 0 0 0 0

Logic cells per mm² in each square millimetre of the die. Hatched outlines are SRAM macros; the red outline is the densest mm² that avoids them (2k logic cells per mm²), found by sliding a 1 mm square over the die in 0.1 mm steps, so it can straddle the fixed squares and find more than any one of them. Squares at the edges are partial, so they read low.

Want a chip of your own like this one?

wafer.space Run 3 takes orders until 9 December 2026. Or start smaller with Tiny Tapeout: the next Tiny Tapeout GF180MCU chips take projects until 7 December 2026, for wafer.space Run 3.